Electronic device and method of making thereof

ABSTRACT

There is provided a method of forming a light source, the method comprising providing a backplane comprising a backplane substrate and a semiconductor particle formed separately from the backplane substrate and then fixed upon the backplane substrate at a predetermined position. The semiconductor particle can be planarized to remove a portion of the semiconductor particle and to expose at a cross-section of the semiconductor particle a planar surface. Moreover, the backplane may comprise a controllable gated electronic component on or directly beneath the planar surface. The controllable gated electronic component may be configured to control an LED emitter. The method further comprises providing the LED emitter comprising one or more LEDs electrically connected to the backplane such that at least one of the LEDs is electrically connected to the controllable gated electronic component.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation-in-part of U.S. patent applicationSer. No. 15/782,360, filed on Oct. 12, 2017, which is incorporatedherein by reference in its entirety. U.S. Ser. No. 15/782,360, in turn,is a continuation-in-part of U.S. patent application Ser. No.15/235,472, filed on Aug. 12, 2016, which is incorporated herein byreference in its entirety. U.S. Ser. No. 15/235,472, in turn, is acontinuation-in-part of U.S. patent application Ser. No. 14/879,884,filed on Oct. 9, 2015, which is incorporated herein by reference in itsentirety. U.S. Ser. No. 14/879,884, in turn, is a continuation-in-partof U.S. patent application Ser. No. 13/992,063, which is the NationalStage of International Application No. PCT/CA12/000956, filed Oct. 12,2012, which claims the benefit of U.S. Provisional Application No.61/547,110, the contents of all of which are incorporated herein byreference in its entirety. U.S. Ser. No. 14/879,884 is also acontinuation-in-part of U.S. patent application Ser. No. 14/019,131,filed on Sep. 5, 2013, which is incorporated herein by reference in itsentirety.

U.S. 15/235,472 is also a continuation-in-part of U.S. patentapplication Ser. No. 15/184,429, filed on Jun. 16, 2016, which isincorporated herein by reference in its entirety. U.S. Ser. No.15/184,429, in turn, is a continuation-in-part of U.S. patentapplication Ser. No. 14/610,567, filed on Jan. 30, 2015 and now issuedas U.S. Pat. No. 9,396,932, which is also incorporated herein byreference in its entirety. U.S. Ser. No. 14/610,567, in turn, claims thebenefit of U.S. Provisional Application No. 62/007,624.

FIELD OF THE INVENTION

The present invention relates to electronic devices and methods ofmaking thereof, and in particular to light sources and methods of makingthereof.

BACKGROUND OF THE INVENTION

Single-crystal silicon is used for most electronic applications.Exceptions exist, such as displays and some imagers, where amorphoussilicon is applied to non-semiconductor substrates in order to operatethe display or imager pixel. In many applications, the display or imageris fabricated on top of the silicon electronics. For application toliquid crystal displays (LCDs), amorphous silicon has providedsufficient performance. For next generation display devices such asOrganic Light Emitting Diodes (OLED), Active Matrix (AM) drivetransistors made from amorphous silicon have proven problematic.Fundamentally, LCDs use voltage devices, and AM-OLEDs require currentdevices. Attempts to extend the conventional approach involve modifyingthe prior-art amorphous-silicon on glass. Amorphous-silicon is appliedto the entire substrate panel, typically greater than two meters on aside, then is re-crystallized using large excimer lasers and scanning aline focus across the panel. The laser has to be pulsed so as to onlymelt the Si surface and not the glass. This technique results in theformation of poly-crystal silicon rather than single-crystal silicon.For some detector applications, Si wafers are butted together to formlarger, albeit more expensive devices.

The mobility of any type of amorphous or poly-crystalline transistor,including non-silicon and organic devices, is much smaller than themobility of single-crystal silicon transistors. Electron mobility inamorphous silicon is ˜1 cm²/V·s compared to ˜100 cm²/V·s forpoly-silicon, and ˜1500 cm²/V·s for high-quality single-crystal silicon.It is therefore advantageous to use single-crystal silicon in place ofamorphous silicon in such devices. In a preferred embodiment of thepresent invention a plurality of planar single-crystal silicon regionson a non-silicon substrate at predetermined locations, for the purposeof electronic device fabrication is fabricated. For example, wafers ofsingle crystal silicon are too costly for large displays and too smallin size: Silicon wafers are typically 300 mm in diameter, compared tocurrent LCD panels at more than 2 meters on a side. By comparison,approximately spherical particles, spheres or spheroidal particles ofsingle-crystal silicon have been manufactured in large sizes less thanor equal to 2 mm, which is large compared to individual pixel sizes.U.S. Pat. No. 4,637,855, incorporated herein by reference, entitledProcess For Producing Crystalline Spherical Spheres, Filed Apr. 30, 1985in the names of Witter et al., describes the manufacture of crystallinespheres.

In the past others have attempted to place diodes upon a curved surfaceof a silicon spheroid however this has proved to be challenging. In theprior art, attempts have been made to lithographically define structureson spherical surfaces, but this requires non-standard optics and has hadlimited success. Making electrical contacts to non-planar surfaces alsorequires non-standard techniques. The complexities involved infabrication have prevented any real progress.

Curved surfaces of Si spheres have also been doped with an n-type dopantto form n-type Si surrounding a p-type Si region which comprises themajority of the surface of a sphere. An embodiment of this inventionrelates to the field of photovoltaic devices, in that the planar surfaceand region directly below can be doped for example with an n-type dopantand a region below with a p-type dopant so as to form a solar cell. Asilicon sphere solar cell is described in a paper entitled CrystalCharacterization of Spherical Silicon Solar Cell by X-ray Diffraction bySatoshi OMAE, Takashi MINEMOTO, Mikio MUROZONO, Hideyuki TAKAKURA andYoshihiro HAMAKAWA, Japanese Journal of Applied Physics Vol. 45, No. 5A,2006, pp. 3933-3937 #2006 The Japan Society of Applied Physics.

This invention however overcomes the limitations of the aforementionedprior art by conveniently utilizing the surface area and region aboutthe planar surface on a planarized particle to fabricate electronicdevices. A planar region having structures formed therein provides aconvenient reliable way in which to provide electrical contacts todifferent parts of the device. Such electronic devices havetraditionally been fabricated using lithographic techniques. However,lithography requires complex equipment and controlled environments, andas a result can be very expensive.

Another very important aspect of this invention is that it enables atechnology that has a smaller carbon footprint by allowing circuits tobe built that consume less power than similar circuitry which utilizesLCD technology.

In displays with previous generation LCD technology, white light isprovided to the rear of the panel of the display, and each LCD pixeluses a filter to select Red (R), Green (G), or Blue (B) light. Filteringin this manner wastes ⅔ of the energy in the backlight. In addition theoperation of the LCD pixel is dependent on the light being polarized, sofurther losses are incurred by the polarizer. In addition, part of eachpixel is occupied by the amorphous silicon transistor, which blockslight coming through the panel.

The present invention enables production of large OLED panels, which aremore efficient that LCD panels. OLED pixels emit at the desired color,R, G, or B only, so no energy is wasted creating other colors, which arethen filtered out and which produce waste in the form of heat. Inaddition, the OLED emitters can be fabricated on top of the backplaneelectronics, so the emission area can be maximized without blockinglight emitting areas of the pixel. By placing the backplane electronicsout of the light path, the design can be optimized for speed and lowpower dissipation, as opposed to being compromised for light pathrequirements.

SUMMARY OF THE INVENTION

According to an embodiment of the present invention there is provided amethod of forming an active matrix OLED display, the method comprising:providing a backplane comprising: providing a backplane substrate;providing semiconductor particles formed separately from the backplanesubstrate; positioning the semiconductor particles at predeterminedpositions on the backplane substrate; immovably fixing the semiconductorparticles to the backplane substrate at the predetermined positions;after immovably fixing the semiconductor particles, removing portions ofeach of the semiconductor particles so as to expose cross-sections ofthe semiconductor particles, wherein the cross-sections are planarsurfaces; and providing one or more controllable gated electroniccomponents on or directly beneath each planar surface, the controllablegated electronic components configured to control pixels of the activematrix OLED display. The method also comprises providing an OLEDassembly comprising one or more pixel regions, the OLED assemblyelectrically connected to the backplane such that at least one of thepixel regions is electrically connected to corresponding one or more ofthe controllable gated electronic components.

The planar surfaces can be less than 15 mm and greater than 1 μm acrossa longest dimension; and the providing the backplane can furthercomprise providing at least two electrical contacts to each controllablegated electronic component supported by the planar surface.

According to another embodiment of the present invention there isprovided a method of forming an active matrix OLED display, the methodcomprising: providing a backplane comprising: a backplane substrate; asemiconductor particle formed separately from the backplane substrateand then fixed upon the backplane substrate at a predetermined position;the semiconductor particle planarized to remove portions of thesemiconductor particle and to expose at a cross-section of thesemiconductor particle a planar surface; and a controllable gatedelectronic component on or directly beneath the planar surface, thecontrollable gated electronic component configured to control one ormore pixels of the active matrix OLED display. The method furthercomprises providing an OLED assembly comprising one or more pixelregions, the OLED assembly electrically connected to the backplane suchthat at least one of the pixel regions of the OLED assembly iselectrically connected to the controllable gated electronic component.

The OLED assembly can be formed separately from the backplane on an OLEDsubstrate different from the backplane substrate, the OLED assemblycomprising one or more pixel contacts corresponding to each pixelregion; and the providing the OLED assembly electrically connected tothe backplane can comprise: joining the OLED assembly to the backplane,the joining comprising electrically connecting at least one of the pixelcontacts corresponding to the at least one of the pixel regions to thecontrollable gated electronic component.

The method can further comprise: before the joining, aligning the OLEDassembly and the backplane with each other in order to align the atleast one pixel contact corresponding to the at least one of the pixelregions with the controllable gated electronic component.

The method can further comprise backfilling with a substantially blackunderfill at least a portion of gaps between the OLED assembly and thebackplane joined together.

The electrically connecting can comprise using one or more of aconductive epoxy, a solder, and low temperature solder to connect atleast one of the one or more pixel contacts to the controllable gatedelectronic component.

The backplane can further comprise: a conformal coating covering thebackplane substrate and at least a portion of the semiconductorparticle; and wherein: the semiconductor particle can be planarized tofurther remove portions of the conformal coating; the planar surface canbe less than 15 mm across its longest dimension; at least a portion ofthe semiconductor particle directly below or on the planar surface canbe doped with a first dopant of a first type and wherein another portionof the semiconductor particle directly below or on the planar surfacecan be doped with a second dopant of a second type, one of the first andsecond dopants being n-type; and the controllable gated electroniccomponent can comprise: a first contact at or above the planar surfacecontacting the first dopant; and, a second contact at or above theplanar surface contacting the second dopant; and the electricalconnection can comprise a conductive link between one of the firstcontact and the second contact and the at least one pixel region.

According to another embodiment of the present invention there isprovided an active matrix OLED display comprising: a backplanecomprising: a backplane substrate; a semiconductor particle formedseparately from the backplane substrate and then fixed upon thebackplane substrate at a predetermined position; the semiconductorparticle planarized to remove portions of the semiconductor particle andto expose at a cross-section of the semiconductor particle a planarsurface; and a controllable gated electronic component on or directlybeneath the planar surface; and an OLED assembly comprising one or morepixel regions, the OLED assembly electrically connected to the backplanesuch that at least one pixel region of the OLED assembly is electricallyconnected to the controllable gated electronic component, the electricalconnection configured to allow the controllable gated electroniccomponent to control the at least one pixel region of the OLED assembly.

The active matrix OLED display can further comprise a substantiallyblack underfill filling at least a portion of gaps between the OLEDassembly and the backplane joined together.

The active matrix OLED display wherein the backplane can furthercomprise: a conformal coating covering the backplane substrate and atleast a portion of the semiconductor particle; and wherein: thesemiconductor particle can be planarized to further remove portions ofthe conformal coating; the planar surface can be less than 15 mm acrossits longest dimension; at least a portion of the semiconductor particledirectly below or on the planar surface can be doped with a first dopantof a first type and wherein another portion of the semiconductorparticle directly below or on the planar surface can be doped with asecond dopant of a second type, one of the first and second dopantsbeing n-type; and the controllable gated electronic component cancomprise: a first contact at or above the planar surface contacting thefirst dopant; and, a second contact at or above the planar surfacecontacting the second dopant; and the electrical connection can comprisea conductive link between one of the first contact and the secondcontact and the at least one pixel region.

According to another embodiment of the present invention there isprovided an imager comprising: a detector assembly for detecting photonsand, in response, producing an electrical signal; a backplanecomprising: a backplane substrate; a semiconductor particle formedseparately from the backplane substrate and then fixed upon thebackplane substrate at a predetermined position; the semiconductorparticle planarized to remove portions of the semiconductor particle andto expose at a cross-section of the semiconductor particle a planarsurface; and a controllable gated electronic component on or directlybeneath the planar surface; and an electrical connection between thecontrollable gated electronic component and the detector assembly, theelectrical connection configured to allow the controllable gatedelectronic component to sample the electrical signal.

The detector assembly can be an X-ray detector.

The imager wherein the backplane can further comprise: a conformalcoating covering the backplane substrate and at least a portion of thesemiconductor particle; and wherein: the semiconductor particle can beplanarized to further remove portions of the conformal coating; theplanar surface can be less than 15 mm across its longest dimension; atleast a portion of the semiconductor particle directly below or on theplanar surface can be doped with a first dopant of a first type andwherein another portion of the semiconductor particle directly below oron the planar surface can be doped with a second dopant of a secondtype, one of the first and second dopants being n-type; and thecontrollable gated electronic component can comprise: a first contact ator above the planar surface contacting the first dopant; and, a secondcontact at or above the planar surface contacting the second dopant; andthe electrical connection can comprise a conductive link between one ofthe first contact and the second contact and the detector assembly.

According to another embodiment of the present invention there isprovided a method of fabricating a backplane, the method comprising:providing a backplane substrate comprising one or more predeterminedpositions each configured to receive one semiconductor particle;providing semiconductor particles formed separately from the backplanesubstrate; placing the semiconductor particles on the backplanesubstrate; mechanically agitating the backplane substrate and thesemiconductor particles to cause one semiconductor particle to occupyeach position; securing the semiconductor particles to the backplanesubstrate at each respective position; and after the securing thesemiconductor particles at each respective position, removing portionsof each of the semiconductor particles so as to expose cross-sections ofthe semiconductor particles, the cross-sections being planar surfaces.

The method can further comprise: providing at least one controllablegated electronic component on or directly beneath each planar surface.

The mechanically agitating can comprise vibrating the backplanesubstrate.

The mechanically agitating can comprise one or more of: rotating thebackplane substrate about one or more axes; and translating thebackplane substrate in one or more directions.

The securing can comprise, before the placing the semiconductorparticles on the backplane substrate, applying an adhesive to eachposition, the adhesive configured to secure at least one semiconductorparticle at each respective position to the backplane substrate.

The securing can comprise heating the semiconductor particles and thebackplane substrate to fuse the semiconductor particles to the backplanesubstrate.

The securing can comprise, after the mechanically agitating, applying aconformal coating onto the backplane substrate to at least partiallycover the semiconductor particles and the backplane substrate; and theremoving can further comprise removing at least a portion of theconformal coating covering the semiconductor particles to expose theplanar surfaces.

According to another embodiment of the present specification there isprovided a method of forming a plurality of electronic devices on asubstrate, the method comprising: providing semiconductor particlesformed separately from the substrate; positioning the semiconductorparticles at predetermined positions on the substrate; immovably fixingthe semiconductor particles to the substrate at the predeterminedpositions; after immovably fixing the semiconductor particles, removingportions of each of the semiconductor particles so as to exposecross-sections of the semiconductor particles, wherein thecross-sections are planar surfaces; and providing one or morecontrollable gated electronic components on or directly beneath eachplanar surface. The providing the one or more controllable gatedelectronic components comprises, for each planar surface: depositing afirst quantity of a first liquid medium comprising a dopant on a firstportion of the planar surface and depositing a second quantity of thefirst liquid medium on a second portion of the planar surface, the firstquantity spaced from the second quantity by a gap; heating the firstquantity, the second quantity, and the corresponding semiconductorparticle, the heating configured to cause diffusion of at least some ofthe dopant from the first liquid medium into the planar surface;depositing a dielectric material on the planar surface in the gap;selectively removing the first quantity and the second quantity from theplanar surface; depositing an electrical contact on each of the firstportion and the second portion; and depositing a further electricalcontact on the dielectric material.

According to another embodiment of the present specification there isprovided an electronic device comprising: a substrate; a semiconductorparticle formed separately from the substrate and then fixed upon thesubstrate; the semiconductor particle planarized to remove portions ofthe semiconductor particle and to expose at a cross-section of thesemiconductor particle a planar surface; and a controllable gatedelectronic component on or directly beneath the planar surface. Thecontrollable gated electronic component is formed by: depositing a firstquantity of a first liquid medium comprising a dopant on a first portionof the planar surface and depositing a second quantity of the firstliquid medium on a second portion of the planar surface, the firstquantity spaced from the second quantity by a gap; heating the firstquantity, the second quantity, and the semiconductor particle, theheating configured to cause diffusion of at least some of the dopantfrom the first liquid medium into the planar surface; depositing adielectric material on the planar surface in the gap; selectivelyremoving the first quantity and the second quantity from the planarsurface; depositing an electrical contact on each of the first portionand the second portion; and depositing a further electrical contact onthe dielectric material.

According to another embodiment of the present specification there isprovided a method of forming an electronic device on a substrate, themethod comprising: providing a semiconductor particle formed separatelyfrom the substrate; immovably fixing the semiconductor particle to thesubstrate; after the immovably fixing, depositing a first quantity of afirst liquid medium comprising a dopant on a first portion of a surfaceof the semiconductor particle and depositing a second quantity of thefirst liquid medium on a second portion of the surface, the firstquantity spaced from the second quantity by a gap; heating the firstquantity, the second quantity, and the semiconductor particle, theheating configured to cause diffusion of at least some of the dopantfrom the first liquid medium into the surface; depositing a dielectricmaterial on the surface in the gap; selectively removing the firstquantity and the second quantity from the surface; depositing anelectrical contact on each of the first portion and the second portion;and depositing a further electrical contact on the dielectric material.

The method can further comprise: before the depositing the firstquantity and the second quantity, forming a barrier island on thesurface in the gap; and before the depositing the dielectric material,selectively removing the barrier island from the surface.

Forming the barrier island can comprise: depositing a third quantity ofa second liquid medium comprising a barrier material on the surface inthe gap.

Forming the barrier island can comprise: depositing a layer of aphoto-reactive material on the surface; exposing a region of thephoto-reactive material overlaying the gap to a light configured tomodify the photo-reactive material; and selectively removing unexposedregions of the layer of the photo-reactive material from the surface,thereby forming the barrier island comprising the photo-reactivematerial modified by the light.

The depositing the dielectric material can comprise: depositing a fourthquantity of a third liquid medium comprising the dielectric material onthe surface in the gap.

The fourth quantity can wet the first quantity and the second quantityat a wetting angle smaller than about 90°.

The heating can also selectively remove the barrier island from thesurface.

The depositing the first quantity and the second quantity can comprise:depositing an initial quantity of the first liquid medium on thesurface, the initial quantity covering the first portion of the surface,the second portion of the surface, and the barrier island disposedbetween the first portion and the second portion; and heating theinitial quantity to reduce a volume of the initial quantity by at leastpartially evaporating one or more components of the first liquid medium,thereby exposing the barrier island and forming the first quantity andthe second quantity separated from one another by the barrier island.

The surface can comprise a planar surface.

The planar surface can comprise a planarized surface of thesemiconductor particle.

The first quantity can be spaced from the second quantity by the gap ina range of about 0.1 μm to about 100 μm.

Printing can be used for one or more of: the depositing the firstquantity; the depositing the second quantity; the depositing thedielectric material; the depositing the electrical contact on each ofthe first portion and the second portion; and the depositing the furtherelectrical contact.

The printing can comprise one or more of: screen printing; flexography;gravure; stamping; offset printing; and inkjet printing.

According to another embodiment of the present specification there isprovided a method of forming an electronic device, the methodcomprising: providing a semiconductor substrate having a surfacecomprising a first portion and a second portion, the first portionspaced from the second portion by a gap; forming a barrier island on thesurface in the gap; depositing a first quantity of a first liquid mediumcomprising a dopant on the first portion of the surface and a secondquantity of the first liquid medium on the second portion of thesurface, the first quantity separated from the second quantity by thebarrier island; heating the first quantity, the second quantity, and thesemiconductor substrate, the heating configured to cause diffusion of atleast some of the dopant from the first liquid medium into the surface;selectively removing the barrier island from the surface; depositing adielectric material on the surface in the gap; selectively removing thefirst quantity and the second quantity from the surface; depositing anelectrical contact on each of the first portion and the second portion;and depositing a further electrical contact on the dielectric material.

The forming the barrier island can comprise depositing a third quantityof a second liquid medium comprising a barrier material on the surfacein the gap.

The forming the barrier island can comprise: depositing a layer of aphoto-reactive material on the surface; exposing a region of thephoto-reactive material overlaying the gap to a light configured tomodify the photo-reactive material; and selectively removing unexposedregions of the layer of the photo-reactive material from the surface,thereby forming the barrier island comprising the photo-reactivematerial modified by the light.

The depositing the dielectric material can comprise: depositing a fourthquantity of a third liquid medium comprising the dielectric material onthe surface in the gap.

The fourth quantity can wet the first quantity and the second quantityat a wetting angle smaller than about 90°.

The heating can also selectively remove the barrier island from thesurface.

The depositing the first quantity and the second quantity can comprise:depositing an initial quantity of the first liquid medium on thesurface, the initial quantity covering the first portion of the surface,the second portion of the surface, and the barrier island disposedbetween the first portion and the second portion; and heating theinitial quantity to reduce a volume of the initial quantity by at leastpartially evaporating one or more components of the first liquid medium,thereby exposing the barrier island and forming the first quantity andthe second quantity separated from one another by the barrier island.

The surface can comprises a planarized surface of the semiconductorsubstrate.

Printing can be used for one or more of: the depositing the firstquantity; the depositing the second quantity; the depositing thedielectric material; the depositing the electrical contact on each ofthe first portion and the second portion; and the depositing the furtherelectrical contact.

According to another aspect and/or embodiment of the presentspecification there is provided a method of forming an active matrixdisplay, the method comprising: providing a backplane comprising:providing a backplane substrate; providing semiconductor particlesformed separately from the backplane substrate; positioning thesemiconductor particles at predetermined positions on the backplanesubstrate; immovably fixing the semiconductor particles to the backplanesubstrate at the predetermined positions; after immovably fixing thesemiconductor particles, removing portions of each of the semiconductorparticles so as to expose cross-sections of the semiconductor particles,wherein the cross-sections are planar surfaces; and providing one ormore controllable gated electronic components on or directly beneatheach planar surface, the controllable gated electronic componentsconfigured to control pixels of the active matrix display. The methodalso comprises providing an LED emitter comprising one or more LEDselectrically connected to the backplane such that at least one of theLEDs is electrically connected to corresponding one or more of thecontrollable gated electronic components.

The LED emitter can comprise one or more individual LEDs, at least oneindividual LED electrically connected to corresponding one or more ofthe controllable gated electronic components.

The LED emitter can comprise one or more individual LED packages, eachLED package comprising one or more corresponding LEDs, at least one LEDpackage electrically connected to the backplane such that thecorresponding LEDs are electrically connected to corresponding one ormore of the controllable gated electronic components.

The LED emitter can comprise an LED assembly comprising one or morepixel regions, the LED assembly electrically connected to the backplanesuch that at least one of the pixel regions is electrically connected tocorresponding one or more of the controllable gated electroniccomponents.

The planar surfaces can be less than 15 mm and greater than 1 μm acrossa longest dimension; and the providing the backplane can furthercomprise providing at least two electrical contacts to each controllablegated electronic component supported by the planar surface.

According to another aspect and/or embodiment of the presentspecification there is provided a method of forming an active matrixdisplay, the method comprising: providing a backplane comprising: abackplane substrate; a semiconductor particle formed separately from thebackplane substrate and then fixed upon the backplane substrate at apredetermined position; the semiconductor particle planarized to removeportions of the semiconductor particle and to expose at a cross-sectionof the semiconductor particle a planar surface; and a controllable gatedelectronic component on or directly beneath the planar surface, thecontrollable gated electronic component configured to control one ormore pixels of the active matrix display. The method further comprisesproviding an LED emitter comprising one or more LEDs electricallyconnected to the backplane such that at least one of the LEDs iselectrically connected to the controllable gated electronic component.

The LED emitter can comprise one or more individual LEDs, at least oneindividual LED electrically connected to the controllable gatedelectronic component.

The LED emitter can comprise one or more individual LED packages, eachLED package comprising one or more corresponding LEDs, at least one LEDpackage electrically connected to the backplane such that one or more ofthe corresponding LEDs are electrically connected to the controllablegated electronic component.

The LED emitter can comprise an LED assembly comprising one or morepixel regions, the LED assembly electrically connected to the backplanesuch that at least one of the pixel regions is electrically connected tothe controllable gated electronic component.

The LED assembly can be formed separately from the backplane on an LEDsubstrate different from the backplane substrate, the LED assemblycomprising one or more pixel contacts corresponding to each pixelregion; and the providing the LED assembly electrically connected to thebackplane can comprise: joining the LED assembly to the backplane, thejoining comprising electrically connecting at least one of the pixelcontacts corresponding to the at least one of the pixel regions to thecontrollable gated electronic component.

The method can further comprise: before the joining, aligning the LEDassembly and the backplane with each other in order to align the atleast one pixel contact corresponding to the at least one of the pixelregions with the controllable gated electronic component.

The method can further comprise backfilling with a substantially blackunderfill at least a portion of gaps between the LED assembly and thebackplane joined together.

The electrically connecting can comprise using one or more of aconductive epoxy, a solder, and low temperature solder to connect atleast one of the one or more pixel contacts to the controllable gatedelectronic component.

The backplane can further comprise: a conformal coating covering thebackplane substrate and at least a portion of the semiconductorparticle. Furthermore, the semiconductor particle can be planarized tofurther remove portions of the conformal coating; the planar surface canbe less than 15 mm across its longest dimension; at least a portion ofthe semiconductor particle directly below or on the planar surface canbe doped with a first dopant of a first type and wherein another portionof the semiconductor particle directly below or on the planar surfacecan be doped with a second dopant of a second type, one of the first andsecond dopants being n-type. Moreover, the controllable gated electroniccomponent can comprise: a first contact at or above the planar surfacecontacting the first dopant; and a second contact at or above the planarsurface contacting the second dopant. The electrical connection cancomprise a conductive link between one of the first contact and thesecond contact and the at least one of the LEDs.

According to another aspect and/or embodiment of the presentspecification there is provided an active matrix display comprising: abackplane comprising: a backplane substrate; a semiconductor particleformed separately from the backplane substrate and then fixed upon thebackplane substrate at a predetermined position; the semiconductorparticle planarized to remove portions of the semiconductor particle andto expose at a cross-section of the semiconductor particle a planarsurface; and a controllable gated electronic component on or directlybeneath the planar surface. The active matrix display also comprises anLED emitter comprising one or more LEDs, the LED emitter electricallyconnected to the backplane such that at least one of the LEDs iselectrically connected to the controllable gated electronic component,the electrical connection configured to allow the controllable gatedelectronic component to control the at least one LED.

The LED emitter can comprise one or more individual LEDs, at least oneindividual LED electrically connected to the controllable gatedelectronic component.

The LED emitter can comprise one or more individual LED packages, eachLED package comprising one or more corresponding LEDs, at least one LEDpackage electrically connected to the backplane such that one or more ofthe corresponding LEDs are electrically connected to the controllablegated electronic component.

The LED emitter can comprise an LED assembly comprising one or morepixel regions, the LED assembly electrically connected to the backplanesuch that at least one of the pixel regions is electrically connected tothe controllable gated electronic component.

The active matrix display can further comprise a substantially blackunderfill filling at least a portion of gaps between the LED assemblyand the backplane joined together.

The backplane can further comprise: a conformal coating covering thebackplane substrate and at least a portion of the semiconductorparticle. Moreover, the semiconductor particle can be planarized tofurther remove portions of the conformal coating; the planar surface canbe less than 15 mm across its longest dimension; at least a portion ofthe semiconductor particle directly below or on the planar surface canbe doped with a first dopant of a first type and wherein another portionof the semiconductor particle directly below or on the planar surfacecan be doped with a second dopant of a second type, one of the first andsecond dopants being n-type; and the controllable gated electroniccomponent can comprise: a first contact at or above the planar surfacecontacting the first dopant; and a second contact at or above the planarsurface contacting the second dopant. Furthermore, the electricalconnection can comprise a conductive link between one of the firstcontact and the second contact and the at least one of the LEDs.

According to another embodiment of the present specification there isprovided a method of forming a light source, the method comprisingproviding a backplane comprising: providing a backplane substrate;providing a semiconductor particle formed separately from the backplanesubstrate; positioning the semiconductor particle at a predeterminedposition on the backplane substrate; immovably fixing the semiconductorparticle to the backplane substrate at the predetermined position; afterimmovably fixing the semiconductor particle, removing a portion of thesemiconductor particle so as to expose a cross-section of thesemiconductor particle, wherein the cross-section is a planar surface;and providing one or more controllable gated electronic components on ordirectly beneath the planar surface, the controllable gated electroniccomponents configured to control a light emitter. The method alsocomprises providing the light emitter connected to the backplane suchthat the light emitter is electrically connected to corresponding one ormore of the controllable gated electronic components.

The light emitter can comprises one or more of: one or more individualLEDs, at least one individual LED electrically connected tocorresponding one or more of the controllable gated electroniccomponents; one or more individual LED packages, each LED packagecomprising one or more corresponding LEDs, at least one LED packageelectrically connected to the backplane such that the corresponding LEDsare electrically connected to corresponding one or more of thecontrollable gated electronic components; and an LED assembly comprisingone or more pixel regions, the LED assembly electrically connected tothe backplane such that at least one of the pixel regions iselectrically connected to corresponding one or more of the controllablegated electronic components.

The method can further comprise electrically connecting the backplane toa circuit board disposed on a side of the backplane opposite the lightemitter.

A circuit board can be disposed between the backplane and the lightemitter, and the light emitter can be electrically connected to thebackplane via the circuit board.

According to another embodiment of the present specification there isprovided a method of forming a light source, the method comprisingproviding a backplane comprising: a backplane substrate; a semiconductorparticle formed separately from the backplane substrate and then fixedupon the backplane substrate at a predetermined position; thesemiconductor particle planarized to remove a portion of thesemiconductor particle and to expose at a cross-section of thesemiconductor particle a planar surface; and a controllable gatedelectronic component on or directly beneath the planar surface, thecontrollable gated electronic component configured to control a lightemitter. The method also comprises providing the light emitterelectrically connected to the backplane such that the light emitter iselectrically connected to the controllable gated electronic component.

The light emitter can comprise one or more of: one or more individualLEDs, at least one individual LED electrically connected to thecontrollable gated electronic component; one or more individual LEDpackages, each LED package comprising one or more corresponding LEDs, atleast one LED package electrically connected to the backplane such thatone or more of the corresponding LEDs are electrically connected to thecontrollable gated electronic component; and an LED assembly comprisingone or more pixel regions, the LED assembly electrically connected tothe backplane such that at least one of the pixel regions iselectrically connected to the controllable gated electronic component.

The method can further comprise electrically connecting the backplane toa circuit board disposed on a side of the backplane opposite the lightemitter.

The circuit board can comprise a Printed Circuit Board (PCB).

A wiring layer can be disposed between the backplane and the lightemitter, and the light emitter can be electrically connected to thebackplane via the wiring layer.

The backplane can comprise: a first conductive via passing through thebackplane and the wiring layer, the first conductive via connecting thecircuit board to the light emitter; and a second conductive via passingthrough the backplane, the second conductive via connecting the circuitboard to the wiring layer.

A circuit board can be disposed between the backplane and the lightemitter, and the light emitter can be electrically connected to thebackplane via the circuit board.

According to another embodiment of the present specification there isprovided a light source comprising a backplane comprising: a backplanesubstrate; a semiconductor particle formed separately from the backplanesubstrate and then fixed upon the backplane substrate at a predeterminedposition; the semiconductor particle planarized to remove a portion ofthe semiconductor particle and to expose at a cross-section of thesemiconductor particle a planar surface; and a controllable gatedelectronic component on or directly beneath the planar surface. Thelight source can also comprise a light emitter electrically connected tothe backplane such that the light emitter is electrically connected tothe controllable gated electronic component, the electrical connectionconfigured to allow the controllable gated electronic component tocontrol the light emitter.

The light emitter can comprise one or more individual LEDs, at least oneindividual LED electrically connected to the controllable gatedelectronic component.

The light emitter can comprise one or more individual LED packages, eachLED package comprising one or more corresponding LEDs, at least one LEDpackage electrically connected to the backplane such that one or more ofthe corresponding LEDs are electrically connected to the controllablegated electronic component.

The light emitter can comprise an LED assembly comprising one or morepixel regions, the LED assembly electrically connected to the backplanesuch that at least one of the pixel regions is electrically connected tothe controllable gated electronic component.

The light source can further comprise a circuit board disposed on a sideof the backplane opposite the light emitter, the backplane electricallyconnected to the circuit board.

The circuit board can comprise a Printed Circuit Board (PCB).

A wiring layer cam be disposed between the backplane and the lightemitter, and the light emitter can be electrically connected to thebackplane via the wiring layer.

The backplane can comprise: a first conductive via passing through thebackplane and the wiring layer, the first conductive via connecting thecircuit board to the light emitter; and a second conductive via passingthrough the backplane, the second conductive via connecting the circuitboard to the wiring layer.

A circuit board can be disposed between the backplane and the lightemitter, and the light emitter can be electrically connected to thebackplane via the circuit board.

BRIEF DESCRIPTION OF THE DRAWINGS

Exemplary embodiments of the invention will now be described inaccordance with the drawings in which:

FIG. 1 is a cross-sectional view of an array of semi-conducting spheresplaced adhesively upon a substrate so as to permanently affix thespheres at predetermined locations.

FIG. 2 is a photograph of an array of glass spheres disposed upon anon-silicon substrate.

FIG. 3a is a cross-sectional view of semiconducting spherical particlesdeposited on a gridded substrate having a conformal coating deposited ontop of the spherical particles.

FIG. 3b is a cross-sectional view of the semiconducting sphericalparticles shown in FIG. 3a after being planarized.

FIGS. 4a through 4f show the method of forming contacts on the planarsurface and to the outside surface of a sphere for example, forproviding an array of solar cells.

FIG. 5a is a partial cross-sectional view of complementary NMOS and PMOScircuits formed on a planarized semiconducting particle doped with ap-type material when forming the particle.

FIG. 5b is a cross-sectional view of a single transistor devicefabricated within a single planarized sphere.

FIG. 5c is an isometric view of a circuit with symbolic representationof gated transistors shown in a planarized spherical particle. Thissingle cell could also form a standalone circuit, be packaged andfunction as a standalone device, replacing a similar device fabricatedon a silicon wafer.

FIG. 5d shows the spherical particle of FIG. 5b illustrating that anarray of such particles can be manufactured in adjacent particles notshown to have transistors therein.

FIGS. 6a through 6d are cross-sectional views of particles wherein themaximum depth is shown normal to a planarized surface.

FIG. 7a shows a cross-section of an example active matrix display.

FIG. 7b shows a cross-section of another example active matrix display.

FIG. 7c shows a cross-section of yet another example active matrixdisplay.

FIG. 8 shows a cross-section of yet another example active matrixdisplay.

FIG. 9 shows a cross-section of a pixel region of an electroluminescentassembly.

FIG. 10 shows a cross-section of yet another example active matrixdisplay.

FIGS. 11a through 11e show steps in a method of forming an electronicdevice on a semiconductor substrate.

FIGS. 12a through 12f show steps in another method of forming anelectronic device on a semiconductor substrate.

FIGS. 13a through 13g show steps in another method of forming anelectronic device on a semiconductor substrate.

FIGS. 14a through 14g show steps in another method of forming anelectronic device on a semiconductor substrate.

FIG. 15 shows a cross-section of an example light source.

FIG. 16 shows a cross-section of another example light source.

FIG. 17 shows a cross-section of yet another example light source.

FIG. 18 shows a cross-section of yet another example light source.

FIG. 19 shows a cross-section of yet another example light source.

DETAILED DESCRIPTION OF THE INVENTION

Turning now to FIG. 1 a substrate 10 is shown which may be plastic,glass, semiconductor material or any other suitable stable material forsupporting an electronic circuit. An adhesive layer 12 is applied to anupper surface of the substrate 10 which has a grid 14 havingpredetermined gaps between grid elements suitably sized to containsemi-conducting spheres 16, having a diameter of less than 15 mm andpreferably less than 2 mm. The term semiconducting sphere, usedhereafter, is to include spheres, spheroids and semiconductingsphere-like objects which may have imperfections, due to defects informing the spheres. The arrangement shown in FIG. 1 conveniently allowsa circuit designer to have a great deal of control in determining wherespherical semiconducting material is to be located, and as a result,where semiconductor devices residing on planar surfaces of the spheres16 are to be fabricated after the spheres are planarized. Although thegrid is shown with same spacing between grid openings, a grid havingnon-uniform spacing can be used to locate spheres in any desiredpattern. If the electronic devices were fabricated on the planarsurfaces prior to positioning the spheres on the substrate, orientingthe spheres would be very difficult. Therefore, the semiconductingspheres 16 are first fixedly attached to the substrate 10 and aresubsequently planarized so as to expose regions of high-qualitysemi-conductor material within the interior of the sphere suitable forfabrication of silicon electronics; by way of example, CMOS devices canbe formed at the planar layer by doping the material of the sphere atthe planar layer and beneath. Spherical particles are described indetail and are particularly convenient to position and planarize,however many other particle shapes can be used, as long as the particlescan be positioned and secured to a substrate conveniently and as long asthe particles can be planarized so as to provide a surface on which tofabricate electronic devices.

Typically, for most chip-based electronics, the unused chip area isreduced to a minimum so the device density is high. The density is sohigh, that the unused substrate area wasted by not having an activedevice fabricated thereon is small. In displays and imagers, the devicearea is specified by requirements that are not electronic. As a result,as the displays become larger, the device density becomes lower. At somepoint, coating several square meters with low-quality Si to make a fewdevices, or a few million compared to 100s of millions in a PC CPU, isno longer desirable. In accordance with this invention, high-quality Siis placed only where it is needed, thereby covering a lower fraction ofthe total display area for large displays. This technological inflectionpoint should occur as a result of the impending crossover to faster OLEDdevices. OLEDs are current devices, and amorphous silicon on glasscannot deliver the required current and speed.

Silicon spheres have been used previously to manufacture large areaphoto-voltaic panels as described in U.S. Pat. No. 4,614,835Photovoltaic Solar Arrays Using Silicon Microparticles, Filed Dec. 30,1983, in the names of Carson et al, incorporated herein by reference.For photo-voltaic applications the surface of the sphere forms theactive area. Silicon spheres can be made from low cost powdered siliconand the resulting re-crystallized surface layer of silicon dioxide cangetter significant impurities. Repeated melting cycles can improve theoverall material purity. Even in the case of poly-crystalline particles,the electron mobility is many times that of amorphous silicon.

In accordance with this invention, it was discovered that for electronicdevices, it is preferable to fabricate devices using the flat surface ofa cross section of a semiconductor particle such as a sphere rather thanthe curved outer surface. The flat surface allows the use of standardlithography techniques, allowing the fabrication of transistors,interconnects, etc. For example, a silicon sphere 20 microns indiameter, provides a maximum area, A=π×r²=˜314 microns for devicefabrication. Many transistors with gate lengths on the order of 1 microncan be fabricated within such an area. For large area displays, only afew transistors are required for each pixel and pixel size does notscale with display size; High Definition (HD) is a standard resolution(e.g. 1920×1080 pixels). In addition, one flat area of high quality,single-crystal silicon can service more than one pixel, as well asprovide added functionality such as self-test and display performancemonitoring and correction.

The use of the flat cross section of a planarized particle such as atruncated planarized sphere allows the use of standard photolithographicfabrication techniques. Furthermore, by planarizing, imperfections thatoccur on the surface of the sphere or spheroid are removed as the sphereor spheroid is etched or polished to expose the inner region.Conveniently, because the spheres are purified in a separate process,high-purity single-crystal material can be realized using hightemperature processes not available to amorphous silicon on glasssubstrates as the glass substrate melts at temperatures lower thanstandard silicon processing temperatures. This is even more importantfor lower melting temperature substrates such as plastics. Truncatedspheres or planarized particles of other shapes can be doped, ormultiply doped just below or above their planar surface to form rings ofn-type and p-type material or “wells” when the cross section is exposed;doping can also occur later in the process. This will allow thefabrication of CMOS devices as is shown in FIG. 5. Although thepreferred way in which to dope a region is by ion-implantation, dopingcan also be achieved by spin-coating dopants onto the planarizedsurface. The outer surface can be highly doped or metallized to form asubstrate contact that can be contacted from either the edge of the topsurface or from anywhere on the spherical surface, which is theeffective backside. The term contact used in this specification can be aphysical wire, or a metallized contact region such as a conductivecontact pad whereby a lead or wire or device can make electricalcontact.

The present invention provides spherical silicon particles at knownlocations on a substrate, which is preferably a non-silicon substrate.Positioning the silicon spheres on a substrate can be done by any ofseveral techniques. Most involve patterning the substrate with aplurality of locations in which spheres are to be placed. Metal ordielectric grids can be permanently or temporarily applied to thesubstrate first, or standard photolithographic techniques can be used.Alternatively dots, dimples, or other patterns of adhesive can beapplied to locate the spheres. Adhesive material with a melting point oradhesive at room temperature appropriately matched to subsequentelectronic processing should be chosen.

As an alternative to a deposited or applied grid, the substrate can bepatterned directly, using standard lithographic techniques to make holesin the substrate in which to deposit adhesive for fixing thesemi-conductor spheres. In some embodiments, a fireable ceramic materialcan be used as the substrate. Holes can be made in the green, i.e.unfired, ceramic using techniques including, but not limited to,punching or drilling.

In another embodiment, silicon particles can be used to form a monolayeron the substrate surface in substitution for non-semiconducting spheresused to form a mask, described in U.S. Pat. Nos. 6,464,890, and6,679,998 Knappenberger et al. filed Aug. 29, 2001 and August 23respectively, incorporated herein by reference. As long as the particlesare a predetermined size, then subsequent processing can provide forplanarized silicon particles such as spherical particles in the requiredlocations.

In FIG. 1 an exemplary technique is shown whereby a metal grid 14 isused with an adhesive layer 12. Spheres 16 are subsequently placed onthe surface in sufficient quantity such that the use of mechanicalvibration to move the spheres around on the grid results in completeoccupation of the grid openings. The mechanical vibration causes thesilicon spheres 16 to move around the volume defined by the substrate,walls and a cover. In a very short time, the spheres 16 move around tosuch a degree that the probability of encountering an available gridlocation is unity, as long as spheres are still available. It iscontemplated that other types of mechanical agitation can be usedinstead of and/or in addition to vibration. For example, the substrate,with the spheres placed on it, can be rotated about one or more axesand/or translated in one or more directions.

FIG. 2 shows a photomicrograph of such a device made on a glasssubstrate with a grid. In this exemplary case, glass spheres are usedand are 20 microns in diameter. Mechanical vibration was used to movethe glass spheres around on the grid. High voltage (V≦12 kV) was thenapplied to the grid to help remove spheres from the top surface of thegrid. Some excess spheres and dirt can also be seen, but these would bereduced or eliminated in a clean room environment and/or removed insubsequent processing steps.

For large areas, spheres can be applied in a dense line across thesurface in one direction and then vibrated across the surface of thesubstrate in a wave. In some embodiments, semi-conductor particles canbe placed on the surface of the substrate to substantially or entirelycover the surface of the substrate before mechanically agitating thesubstrate and the semi-conductor particles.

It is contemplated that similar techniques, using mechanical agitation,can be used, whereby the substrate comprises through holes atpredetermined positions for at least partially receiving thesemi-conductor particles. A layer of adhesive can be applied to one faceof the substrate, with the adhesive layer covering one end of thethrough holes. The semi-conductor particles can be placed on the otherface of the substrate, opposite the face bearing the adhesive layer, andthen the substrate and the semi-conductor particles can be mechanicallyagitated to cause the semi-conductor particles to at last partiallyoccupy the holes in the substrate. The semi-conductor particles canadhere to the portions of the adhesive layer accessible through theholes, and as a result be retained and/or secured in the holes. Theadhesive layer can comprise glass paste or other suitable adhesive knownto the skilled person.

Alternatively, electric fields can be applied using external electrodesin order to move the particles on the substrate as described in“Mechanics of a process to assemble microspheres on a patternedelectrode,” Ting Zhua, Zhigang Suob, Adam Winkleman and George M.Whitesides, APPLIED PHYSICS LETTERS 88, 144101 (2006), hereafterreferred to a reference 1. In this approach an electric potential iscreated using a bottom electrode placed underneath the dielectricsubstrate and the conductive grid is used as the counter electrode. Theholes in the grid create a potential well that the spheres can drop downinto. The electric field gradient around the hole is sufficient tocreate a net force acting on the particle. For large enough appliedfields (KV), the particles can be moved into the holes. Vibration may berequired initially, to move the spheres around so that they encounterthe potential well.

In another approach, a similar process to that used in laser printingcan be utilized. In laser printers, triboelectrically generated chargeis applied to toner particles. The charged toner particles are thenapplied to an electrostatically charged (drum) substrate. In laserprinting the toner particles are then transferred to anelectrostatically charged substrate typically paper. In laser printingthe laser is used to write the pattern on the charged drum, but sincethe pattern wouldn't change in a production environment, the laser canbe replaced by a grid. In first generation laser printers, tonerparticle size of approximately 16 microns was on the same order as thespheres of FIG. 2. By applying a voltage to an electrode underneath thedielectric substrate to attract the charged spheres, and the oppositepolarity to the grid, the spheres are selectively attracted to theholes. This approach can be viewed as an enhancement of the approachdescribed in reference 1.

In an alternative embodiment of the present invention, the array ofspheres could then be transferred from the first substrate, actingsimilarly to laser printer drum, to another, un-patterned substrate,acting similarly to the charged paper, in a complete analogy to laserprinting described. Alternatively, transferring of the array from firstto second substrates can also be accomplished if the adhesive on thesecond, un-patterned substrate, or adhesive applied to the spheres has ahigher melting temperature, greater adhesion or electrostaticattraction, for example. While the exemplary device of FIG. 1 uses anadhesive layer, the substrate or grid under layer can be a heat-softenedlayer, such as thermoplastic layer at elevated temperature so thespheres adhere on contact and remain in place when the substrate iscooled to ambient temperature. The adhesive can be a thin layer appliedto substrate. The relatively small size of the spheres means thatsignificant contact area is achieved for a small layer thickness ofadhesive.

Since silicon has a higher melting temperature than glass, a glasssubstrate can be used directly if sufficiently heated to soften theglass and so allow the spheres, either coated with silicon dioxide orstripped of oxide, to adhere directly to the glass, providing anassembly that can be subjected to higher post-processing temperatures.This can be accomplished by transferring the arrayed particles from apatterned substrate onto un-patterned glass using electrostaticattraction, as in laser printing. By fixing the particles directly tothe glass the window for higher temperature processing can be extendedto the point where the cross sectional interior of the semiconductingspheres is exposed. The same printing process can be used for othersubstrates.

Once the spheres 16 are in place, a conformal coating 18 is applied andsubsequently planarized using a modification of the standardplanarization techniques, such as chemo-mechanical polishing, as shownin FIG. 3a where the coating layer 18 of SiO₂ is shown covering thespherical particles 16 and the grid 14. FIG. 3b shows the same array ofFIG. 3a after planarization and before devices are fabricated on thetruncated spheres in the form of hemispheres. Standard planarizationtechniques used in integrated circuit fabrication can be utilized.Planarization can occur multiple times in the process because asmultiple layers are deposited sequentially, the topography can exceedthat supported by the process, therefore after a conformal dielectriccoating is applied it is then planarized; and when a conductive coatingis applied it is then planarized. Connections between layers are made byopening holes or vias at lithographically defined locations anddepositing conductive connections or plugs between layers. This isparticularly advantageous. In the case of a planarized metal layer, thelayer would be patterned to form the required interconnects. In thepresent invention, the process of planarization is performed to exposethe interior cross-section of the semiconductor particles, as opposed tothe prior art of planarizing the surface without exposing all of theunderlying elements, as described in U.S. Pat. No. 4,470,874, entitledPlanarization of multi-level interconnected metallization system, filedDec. 15, 1983, incorporated herein by reference.

Although the silicon spheres are placed with random orientation, theanisotropy of mobility in Si is small, so the resulting devices that arefabricated will be much higher performance than those made usingamorphous- or poly-silicon. However, if the application is lessdemanding and for example does not require high-speed devices, thenpoly-silicon or non-spherical particles can be used.

While spherical particles are preferred, powdered silicon can be used,either single- or poly-crystal, if appropriate to the performancerequirements of a particular application. In addition, multipleplacement cycles can be used to place particles of different sizes, ordifferent material characteristics, such as doping or crystallinequality or atomic species, such III-V, for example GaAs, or quaternaryalloys for use as optical sources, or SiGe, to realize differentfunctionality in the final device.

Standard photolithographic techniques are used to fabricate devices onthe exposed silicon surfaces as well as fabrication of interconnects andother elements required for device functionality. The present inventionallows for nearly conventional CMOS devices to be fabricated; and, itmay be advantageous to utilize other processes. The present inventiondoes not intrinsically restrict the type of process that can be used.For example, particles of n and p type silicon can be deposited inseparate steps, to achieve n- and p-wells using separate siliconparticles. In conventional CMOS, the n-well shown in FIG. 5a must befabricated within the global p-type substrate. Turning now to FIG. 5b ,a device similar to that of FIG. 5a is shown fabricated within aspherical particle that is doped with a p-type material for form ap-type sphere. In this figure a semi-spherical semiconductor device 50is shown wherein a planarized sphere 56 forms a gated semiconductortransistor device having a source (S), drain (D) and Gate (G) as well acontact B which forms a substrate bias as the device is within a dopedwell, as shown. In this instance a single device is formed within theplanarized semiconducting sphere. Each of the lines extending from thedevice to B, S, D, and G are electrical contacts. The number of separatedevices that can be manufactured on within/upon a single crystalparticle depends greatly on the size of the planarized region. Forexample if the device has a 1 μm gate length and 1 μm via holes, theentire device maybe 5 μm×5 μm device. However, a sphere with a 20 μmdiameter would have a surface area of greater than 300 μm² which couldaccommodate several devices. By way of example a 2×2 pixel array or asingle pixel with additional circuitry for example for lifetime-controlcould be inbuilt. Considerations of sphere size would be cost,reliability and yield. The device shown in FIG. 5a could be fabricatedon any or all of the planar spheres shown for example in FIG. 3 b.

A symbolic representation of transistors 55 a 55 b is shown in FIGS. 5cand 5d . Further doping occurs to achieve the NMOS and PMOS devices inthe same sphere. In FIG. 5c an array of controllable functional devicessuch as transistors can be fabricated. Although not shown in the array58 of planarized spheres 56, an array of devices would be manufacturedwithin the same process. That is, doping would be done to alltransistors at the same time. A passivation layer 59 is applied directlyover top of the planarized spheres after devices are fabricated. Thelayer 59 is shown before it is laid down over the active devices.Although an advantage of this invention is that an array of any size canbe manufactured it may be desired to cut up the array into smallerfunctional units which can be placed in desired locations. Current meansfor cutting silicon wafers can be used in this instance.

The resulting electronic assembly can then be used as the basis for avariety of devices such as displays, or imagers.

In accordance with an aspect of this invention non-glass substrates,such as plastic, Mylar, polyimide or other application appropriatematerial, can also be used, allowing not only decreased cost ofproduction, but also the realization of both flexible and moldabledevices. As the dimensions of the semiconductor particle are reduced,the minimum bend radius is also reduced. For silicon particles, whichare smaller than the substrate thickness, the mechanical properties willbe largely dictated by the non-silicon elements of the device and so canbe made either flexible or moldable or a combination thereof. Devicescan also be fabricated where the mechanical properties vary throughoutthe device, where the mechanical stiffness is specified as a function ofposition within the device.

In a further variation of the present invention, large substrates can becut to form small devices, in the same way that silicon wafers are cutinto devices of a preferred size; the device is small relative to thesubstrate. The present techniques would applicable where the costs andperformance allowed the use of non-silicon substrates. In many silicondevices for example, the area occupied by the contact pads andinterconnects can be on the same order as the device area. In otherapplications, device performance can be enhanced by using a substratewith a large thermal conductivity. Here the spherical backside of theparticle provides a larger surface through which heat can be removed.

As was mentioned heretofore, this invention also allows for themanufacture of solar cells using a similar fabrication method. Turningnow to FIGS. 4a through 4f a process of manufacturing solar cells isshown, wherein spheres 16 doped with p-type material shown in FIG. 4aare located in openings with a grid 14 and are fixed to the lighttransmissive substrate 10 they are supported by. In FIG. 4b the spheresand grid are coated in a layer 43 of SiO₂ and in FIG. 4c a metallizationlayer 45 is applied. In FIG. 4d the structure is planarized and thespheres have planar upper surfaces 47. In FIG. 4e vias and conductingplug formation 48 is provided. Also not shown in FIG. 4e , the planarregion just below the planar surface is doped with n-type material andin a subsequent step in FIG. 4f interconnects 46 and 49 are formed sothat all interconnects are on the planar upper surface which contact thep and n material. This upper planarized surface actually forms thebackside of the solar panel.

The term planarized particle or particle having a planar surface refersto particles in a preferred embodiment that have a longest dimensionacross the planar surface of 15 mm and a depth (d) of at least 1 μmnormal to the planar surface. Preferably these particles are spheres,spheroids or imperfect spheres or spheroids. However other particleshapes are within the scope of this invention. FIGS. 6a through 6dillustrate various particle shapes 60 and show depth (d) normal to theplanar surface of the particle.

Arrays of electronic devices fabricated according to the foregoingdescription, including but not limited to the electronic device shown inFIG. 5d , can be used as backplanes for active matrix electro-opticaldevices. These electro-optical devices can include, but are not limitedto, displays and imagers. In these devices, the controllable gatedelectronic components fabricated on and/or beneath the planar surfacesat the planarized cross-sections of the semiconductor particles can beelectrically connected to one or more pixels of the optical portion ofthe electro-optical device. The optical portion can comprise alight-emitting portion in the case of a display and/or a light-detectingportion in the case of an imager. The controllable gated electronicdevices, including but not limited to transistors, can be used tocontrol and/or power the light-emitting pixels in the case of a display,and/or to sample the electrical signal from light-detecting pixels inthe case of an imager.

FIG. 7a shows a schematic representation of a cross-section of a display700, comprising a backplane 705 electrically connected to a lightemitting assembly. The light emitting assembly can include, but is notlimited to, an organic light emitting diode (OLED) assembly 715, inwhich case display 700 can be an active matrix OLED display. While thefollowing description refers to OLED assemblies, it is contemplated thatthe light emitting assembly can be any suitable electroluminescentassembly known to the skilled person.

The backplane assembly for display 700 can comprise planarizedsemiconductor particles, such as planarized spheres 56, secured tosubstrate 10. Substrate 10 will henceforth be referred to as “backplanesubstrate 10”. For the purposes of this description, substrate 10 andbackplane substrate 10 can be interchangeable. One or more controllablegated electronic components, including but not limited to transistor 55a, can be formed on and/or beneath the planar surface at the planarizedcross-section of planarized spheres 56. While in FIG. 7a only onetransistor 55 a is shown per planarized sphere 56, two or morecontrollable gated electronic components can be formed on and/or beneaththe planar surface at the planarized cross-section of one or more of thesemiconductor particles of backplane 705. The controllable gatedelectronic components can also be of different types and designs,including but not limited to different varieties of transistors. Thecontrollable gated electronic components can also comprise anylithographically patterned circuit element. The following descriptionrefers to transistor 55 a, but it is contemplated that any type and/orvariety of suitable circuit element and/or electronic component known tothe skilled person can be used instead of and/or in addition totransistor 55 a.

Contact 710 can be formed on and/or beneath the planar surface at theplanarized cross-section of planarized spheres 56. Contact 710 is inelectrical contact with transistor 55 a. In addition and/oralternatively, contact 710 can be in electrical contact with one or moreother circuit elements and/or combinations of circuit elements. Suchcircuit elements can include but are not limited to capacitors. While inFIG. 7a only one contact 710 is shown for transistor 55 a, it iscontemplated that two or more contacts can be formed for eachtransistor, according to the design of the transistor and/or the numberand types of connections needed between transistor 55 a and pixels ofOLED assembly 715. Contact 710 can comprise a deposited layer of aconductive material, including but not limited to a metallic material.In addition and/or alternatively, contact 710 can comprise: metal filledepoxies including but not limited to silver epoxy, carbon filled epoxy,and low temperature solders comprising indium or indium-tin alloys.

OLED assembly 715 can comprise OLED substrate 720 and one or moreorganic light emitting layers 740 in contact with one or moreelectrodes. In one embodiment, OLED assembly 715 can comprise one ormore pixel regions 725,730. One or more of pixel regions 725,730 cancomprise a first electrode 735 deposited on OLED substrate 720, one ormore organic light emitting layers 740 deposited on first electrode 735,and a second electrode 745 deposited on one of the organic lightemitting layers 740 to sandwich at least one of the organic lightemitting layers 740 between first electrode 735 and second electrode745. While FIG. 7a shows each pixel region 725,730 having its own stackof first electrode 735, organic light emitting layers 740, and secondelectrode 745, it is contemplated that one or more of the firstelectrode 735 and organic light emitting layers 740 can span multiplepixel regions. While a particular architecture and geometry of OLEDassembly 715 is shown and described, it is contemplated that differentarchitectures and geometries of OLED assembly 715 known to the skilledperson can also be used for display 700.

OLED substrate 720 can comprise a material at least partiallytransparent to the light emitted by organic light emitting layers 740.OLED substrate 720 can comprise materials including but not limited toglass, plastic, and polyimide. First electrode 735 can comprise anelectrically conductive material at least partially transparent to thelight emitted by organic light emitting layers 740. First electrode 735can comprise indium tin oxide (ITO). In some embodiments, OLED substrate720 can function also as the first electrode. Second electrode 745 cancomprise a layer of conductive material, including but not limited toaluminum and/or copper.

Adjacent pixel regions 725,730 can be distinguished from one another byone or more of separate first electrodes 735, separate organic lightemitting layers 740, and/or separate second electrodes 745. In someembodiments, one or more of pixel regions 725,730 can each have two ormore distinct second electrodes, which can act as pixel contacts fortheir respective pixel region. In FIG. 7a , dotted lines across OLEDsubstrate 720 demarcate the approximate boundaries of each pixel region725,730. These dotted lines are for illustration purposes, and do notnecessarily represent a physical feature of OLED assembly 715.

An active matrix OLED display can be formed by electrically connectingbackplane 705 to OLED assembly 715 such that at least one of the pixelregions 725,730 is electrically connected to corresponding one or moreof the controllable gated electronic components, for example, totransistor 55 a. In FIG. 7a , pixel region 725 is shown as beingconnected to only one contact 710 of transistor 55 a. In otherembodiments, others ways of connecting pixel regions to transistors caninclude, but are not limited to: one pixel region can be connected tomultiple transistor contacts and/or to multiple transistors; onetransistor contact 710 and/or one transistor 55 a can be connected tomultiple separate second electrodes, i.e. pixel contacts, of pixelregion 725; and one transistor 55 a can be connected to multipledifferent pixel regions 725,730.

OLED assembly 715 can be electrically connected to backplane 705 throughone or more conductive links 750. Conductive link 750 can connecttransistor 55 a to a corresponding pixel region 725. Conductive link 750can comprise an electrically conductive bridge between contact 710 andsecond electrode 745. Conductive link 750 can comprise a soft and/orflexible conductive link. Conductive link 750 can comprise one or moreof a conductive epoxy such as silver epoxy, a solder, and a lowtemperature solder. In some embodiments, transistor 55 a may not have apreformed contact 710, and conductive link 750 can connect secondelectrode 745 to transistor 55 a. In some embodiments, pixel region 725may not comprise a second electrode 745, and conductive link 750 canconnect contact 710 and/or transistor 55 a directly to at least one theorganic light emitting layers 740.

Using a soft and/or conductive link 750 can reduce the likelihood ofconductive link 750 damaging organic light emitting layers 740 and/orthe likelihood of conductive link 750 causing an electrical short withfirst electrode 735 as a result of conductive link 750 breaking throughsecond electrode 745 and organic light emitting layers 740. Using aconductive link 750 that can be applied at relatively low temperaturescan reduce the likelihood of thermal degradation and damage to organiclight emitting layers 740, which can be temperature sensitive.

Active matrix OLED display 700 can be formed by electrically connectingbackplane 705 to OLED assembly 715, using conductive links 750 asdescribed above. In order to enable each pixel region 725,730 to beadjacent its corresponding transistor 55 a prior to connecting the two,prior to joining backplane 705 to OLED assembly 715, backplane 705 andOLED assembly 715 can be aligned with each other. The aligning can beperformed using optical or physical markers on one or both of backplane705 and OLED assembly 715. The aligning can also be performed by placingbackplane 705 and OLED assembly 715 in a jig that determines theirposition relative to one another.

When backplane 705 is joined to OLED assembly 715 by conductive links750, gaps 760 may remain between backplane 705 and OLED assembly 715.These gaps 760 can be partially or completely filled with a backfillmaterial to further mechanically strengthen the connection betweenbackplane 705 and OLED assembly 715. In addition, the backfill materialcan be opaque, light scattering, and/or light absorbing in order toreduce and/or eliminate any visible reflections from backplane substrate10 that might interfere with the image generated by the OLED display700. In some embodiments, the backfill material can be substantiallyblack. Being substantially black can comprise reflecting a sufficientlysmall portion of the light incident upon the backplane so that thisreflected light would not constitute a human-visible interference withthe image generated by the OLED display 700.

During fabrication of OLED display 700, backplane 705 and OLED assembly715 can be formed separately and then joined together. For example,backplane 705 can be formed according to the foregoing description. OLEDassembly 715 can be formed separately from backplane 705 and on OLEDsubstrate 720, which is distinct from backplane substrate 10. FormingOLED assembly 715 separately from forming backplane 705 allows each partof the fabrication process to be optimized independently. In addition,this bifurcated fabrication process allows for separate quality controlfor the OLED assembly process and the backplane fabrication process. Adefect in a batch of backplanes 705 or OLED assemblies 715 would affectonly that subcomponent, instead of affecting the entire display 700.

In addition, separate fabrication of OLED assembly 715 can allow forbetter control over formation of the different components of pixelregions 725,730, including organic light emitting layers 740. OLEDsubstrate 720 and/or first electrode 735 can constitute a more suitablesubstrate, e.g. flatter or smoother, for depositing organic lightemitting layers 740 which can be sensitive to unevenness of thesubstrate they are deposited on. More consistent deposition of organiclight emitting layers 740 can also reduce the likelihood of punchthrough electrical shorts, which can be caused by damaged organic lightemitting layers 740 that allow electrical contact between firstelectrode 735 and second electrode 745, conductive link 750, and/orcontact 710.

To operate OLED display 700, an electrical potential is applied betweenfirst electrode 735 and second electrode 745, thereby applying apotential to organic light emitting layers 740. First electrode 735 canbe connected to a transistor, power source, and/or an electrical lead onbackplane 705, and/or first electrode 735 can be connected to a powersource and/or electrical lead independent of backplane 705. Secondelectrode 745 can be connected to transistor 55 a. One or more of theorganic light emitting layers 740 can then emit human visible lightwhich can be emitted through first electrode 735 and OLED substrate 720and out of OLED assembly 715 in the direction of light emission 755.Transistor 55 a can power, and/or control the power applied to, theorganic light emitting layers 740 to control emission attributes ofpixel regions 725,730 including but not limited to brightness and on/offstatus.

While FIGS. 7a , 8, 9, and 10 show three organic light emitting layers740, it is contemplated that fewer or more than three organic lightemitting layers can be used. When there are multiple organic lightemitting layers 740, the layers can comprise different materials.

In some embodiments, each pixel region 725,730 can emit only one color.In other embodiments, pixel regions 725,730 can emit multiple colors.For example, each pixel region 725,730 can have multiple sub-pixelregions each emitting one color. For example, each sub-pixel can emitone of red, green, and blue color light. When pixel regions 725,730 havesub-pixel regions, each sub-pixel region can have its own separatesecond electrode 745, i.e. its own separate sub-pixel contact. Eachsub-pixel region can be controlled by one or more correspondingtransistors.

While the above description related to FIG. 7a discloses an OLED display700, it is contemplated that a similar structure and method offabrication can be used to implement an active-matrix light emittingdiode (LED) display, where the light emitters are LEDs instead of and/orin addition to OLEDs. In some implementations, these LEDs can comprisenon-organic light emitting materials. In other implementations, theseLEDs can comprise both non-organic LEDs and OLEDs.

In such an LED display (being the LED display version of of OLED display700), the LEDs and/or LED pixel regions can be formed as a layeredstructure on substrate 720, similar to the OLED structures shown in FIG.7a . In other implementations, one or more LEDs and/or chipLEDs can beformed separately from substrate 720, and then placed on and/or securedto substrate 720. Such arrangements of LED pixel regions, LEDs, and/orchipLEDs on substrate 720 can form an LED assembly, which can then beelectrically connected to backplane 705 such that at least one of theLED pixel regions (or LEDs or chipLEDs as the case may be) iselectrically connected to corresponding one or more of the controllablegated electronic components such as transistor 55 a on backplane 705. Insome implementations, to control and/or drive each LED pixel regionand/or LED in the LED display, each LED pixel region and/or LED can beconnected to at least one transistor.

Referring now to FIG. 7b , a schematic, cross-sectional representationof another exemplary LED display 700′ is shown. LED display 700′comprises LEDs 768R, 768G, and 768B (collectively or genericallyreferred to as LEDs 768) electrically connected to and/or controlled bybackplane 762. Backplane 762, in turn, can comprise planarized spheres766 secured to substrate 764. Planarized spheres 766 can be similar toplanarized spheres 56, and substrate 764 can be similar to substrate 10.In some implementations, planarized spheres 766 can comprisesingle-crystal silicon. Moreover, in some implementations substrate 764can comprise Low Temperature Co-fired Ceramic (LTCC) such as, but notlimited to, DuPont™ 951.

In some implementations, using LTCC as substrate 764 can facilitatethermal management of LED display 700′. For example, thermal vias can beincorporated into the LTCC, either by providing a thermal path throughthe back using electrical connectors 776 and 778, or by other suitablemethods configured to remove heat from emissive elements (i.e. LEDs) tothe back (i.e. the side opposite the side bearing the LEDs) of backplane762.

The difference between backplane 762 and backplane 705 is that inbackplane 762 the planarized surface of planarized spheres 766 is raisedrelative to and/or offset from the planar surface of substrate 764. Insome implementations, this difference need not exist and backplane 762can be identical to backplane 705. Each of LEDs 768 can comprise acorresponding electrical connector 770 for connecting LED 768 tobackplane 762.

LED display 700′ also comprises a dielectric and/or wiring layer 772disposed between LEDs 768 and backplane 762. Electrical connectors 770can connect to backplane 762 via dielectric and/or wiring layer 772.Dielectric and/or wiring layer 772 can facilitate connecting multipleLEDs 768 to one or more corresponding electrical components (such astransistors) on or directly beneath the planar surface of planarizedspheres 766. Moreover, LED display 700′ can comprise LEDs 768 ofdifferent colors such as LED 768R, which can emit red light, LED 768Gwhich can emit green light, and LED 768B which can emit blue light.Other color LEDs can also be used. In some implementations, groups ofdifferent color LEDs 768 can be arranged into pixels of the LED display700′, which pixel can display a variety of different colors byactivating combinations of different color LEDs 768.

In some implementations, LEDs can have a bottom (i.e. proximate tobackplane 762) electrical contacts instead of and/or in addition toelectrical connectors 770. Moreover, in some implementations, after LEDs768 are positioned on and connected to backplane 762, the LEDs 768 canbe partially or fully covered by optical encapsulation 774. Thisencapsulation can protect LEDs 768 from the elements such as humidityand dust, while allowing most of the light emitted by LEDs 768 to betransmitted. Optical encapsulation 774 can comprise, for example andwithout limitation, DuPont™ 8190 or similar glass paste. In someimplementations, this glass paste can be suitably thinned as needed andspun-on (or otherwise applied) as a conformal coating.

Backplane 762 also comprises electrical connectors 776 and 778 that runthrough a thickness of substrate 764 and connect dielectric and/orwiring layer 772 to a power source (not shown) located on a side ofbackplane 762 opposite the dielectric and/or wiring layer 772. In someimplementations, a conductive layer 780 can be applied to a side ofsubstrate 764 opposite the dielectric and/or wiring layer 772.Conductive layer can comprise a metal and can be used to bring power toelectrical connectors 776 and 778.

It is contemplated that LED displays 700′ can be tiled together to formlarger tiled displays and/or video walls. In such tiled arrangements,edge connections for bringing power and/or control signals to backplane762 can be difficult because edges of backplane 762 can be abuttingagainst and blocked by edges of its neighboring display tiles. In suchtiled configurations, back electrical and control signal connections (asmade possible by electrical connectors 776,778 and/or conductive layer780) can provide an alternative means of bringing power and/or thecontrol signal to the display tiles.

While FIG. 7b shows electrical connectors 776,778 and conductive layer780, it is contemplated that other implementations need not haveelectrical connectors 776,778 and/or conductive layer 780. In suchimplementations, edge connections can be used to bring power and/or thecontrol signal to backplane 762 and/or to the dielectric and/or wiringlayer 772. The power and/or the control signal can be used to operatethe electronic components of backplane 762 and/or LEDs 768, which LEDsare controlled by backplane 762.

In some implementations, individual LEDs 768 can be individually pickedand placed on backplane 762. In other implementations, individual LEDs768 can be secured to a backing or support substrate first, and thenelectrically connected to backplane 762. This securing of the LEDs tothe backing or support substrate can fix the position of the LEDsrelative of one another before all the LEDs are connected to thebackplane. Such LEDs secured to the backing or support substrate canalso be described as an LED assembly. In yet other implementations, LEDs768 can be placed in a jig or retainer, which fixes the position of theLEDs relative to one another. Then the LEDs can be electricallyconnected to backplane 762. After the LEDs are connected to thebackplane, the LEDs can be removed from the jig or retainer, and the jigor retainer can be removed and reused.

Referring now to FIG. 7c , a schematic, cross-sectional representationof another exemplary LED display 700″ is shown. LED display 700″ issimilar to LED display 700′, with the difference being that whereasindividual LEDs are used in LED display 700′, LED display 700″ comprisesindividual LED packages 782. Each individual LED package 782 comprisesone or more individual LEDs. In some implementations, each LED package782 can comprise LEDs capable of emitting primary colors. In yet otherimplementations, each LED package can comprise a sufficient variety ofdifferent color LEDs to be able to operate as an individual color pixel.Each LED package 782 also comprises electrical contacts 784 and 786, forconnecting LED package 782 to backplane 762, either directly or viadielectric and/or wiring layer 772. In some implementations, electricalcontacts 784 and 786 can allow each LED within LED package 782 to becontrolled separately and/or controlled using separate correspondingcontrol signals and/or power signals. In other implementations, all theLEDs in the LED package 782 can be controlled with the same controlsignal and/or power signal.

Moreover, in some implementations, LED packages can comprise otherelectrical or electronic components for operating the individual LEDscontained within each LED package. In some implementations, the LEDpackages can comprise but are not limited to chipLEDs or Surface MountDevices (SMD) containing LEDs.

In some implementations, LRTB R48G chipLED made by OSRAM™ OptoSemiconductors can be used as a non-limiting example of an LED package.LED packages 782 can be positioned and/or placed on backplane 762 by anyone or more of the different methods described above in relation topositioning individual LEDs on backplane 762.

In general, the active matrix LED displays described herein comprise thebackplanes described herein electrically connected to an LED emittercomprising one or more LEDs electrically connected to the backplane suchthat at least one of the LEDs is electrically connected to correspondingone or more of the controllable gated electronic components of thebackplane. The LED emitter can comprise any suitable collection,arrangement, or configuration of one or more LEDs. For example, andwithout limitation, the LED emitter can comprise individual LEDs and/orindividual LED packages electrically connected to the backplane, asshown in FIGS. 7b and 7c respectively. In other implementations, the LEDemitter can comprise an LED assembly in turn comprising LEDs and/or LEDpixel regions formed on a substrate 720. In yet other implementations,the LED assembly can comprise LEDs or LED packages formed separatelyfrom the substrate and then secured to the substrate, the substratebeing separate from the backplane.

The active-matrix LED displays disclosed herein can be used as videowalls and/or other types of displays. Such active-matrix LED displayscan be used individually, or can be tiled together to cover largerareas.

Turning now to FIG. 8 a cross-section of active matrix display 800 isshown, which active matrix display 800 can be an active matrix OLEDdisplay. Backplane 705 is the same in display 800 as in display 700, andcomprises transistors 55 a, with contacts 710, formed on and/or beneaththe planar surfaces of planarized spheres 56 secured to backplanesubstrate 10. Display 800 is different from display 700 in that indisplay 800 the light-emitting assembly is deposited directly ontobackplane 705. For example, organic light emitting layers 740 can bedeposited directly on planar surface of planarized sphere 56, so that atleast one of the organic light emitting layers 740 is in electricalcontact with contact 710 of transistor 55 a.

First electrode 735 can be deposited onto one of and/or the outer-mostof organic light emitting layers 740. While organic light emittinglayers 740 and first electrode 735 are shown as forming discrete stacksover each different transistor 55 a, it is contemplated that one or moreof the organic light emitting layers 740 and/or first electrode 735 canbe deposited as a layer spanning multiple transistors 55 a.

In some embodiments, organic light emitting layers 740 can be depositedon the surface of backplane substrate 10 outside of the planar surfacesof planarized spheres 56 as well as on the planar surfaces of planarizedspheres 56. In some embodiments, the surface of backplane substrate 10can be coated with a material such as glass encapsulant, vitrifiedglass, and/or plastics to reduce and/or eliminate the porosity of thesurface of backplane substrate 10 before depositing subsequent layerssuch as organic light emitting layers 740. In some embodiments, theremay be a second electrode layer deposited on contact 710, prior todepositing organic light emitting layers 740 and first electrode 735.

First electrode 735 can be connected to a transistor, power source,and/or an electrical lead on backplane 705, and/or first electrode 735can be connected to a power source and/or electrical lead independent ofbackplane 705. When a potential is applied between contact 710 and firstelectrode 735, organic light emitting layers can emit human visiblelight, in the direction of light emission 755. Similar to display 700,pixel regions 805,810 of display 800 can each emit only one color, ormultiple colors. It is contemplated that other layers may be depositedas part of display 800, which layers can include but are not limited topassivation layers, encapsulation layers, and/or protective layers.

FIG. 9 shows a cross-section of pixel region 905, which can form part ofan OLED assembly used to form and OLED display similar to display 700.Pixel region 905 is similar to pixel regions 725,730 in that pixelregion 905 comprises an OLED substrate 720, a first electrode 735 formedon OLED substrate 720, organic light emitting layers 740 formed on firstelectrode 735, and a second electrode 910 formed on organic lightemitting layers 740. Pixel region 905 is different from pixel regions725,730 in that second electrode 910 comprises an extension 915.Extension 915 can span beyond organic light emitting layers 740 andfirst electrode 735 of pixel region 905. Extension 915 can be formeddirectly over OLED substrate 720. Second electrode 910 and/or itsextension 915 can be insulated from first electrode 735 by insulatingregion 920. Insulating region 920 can comprise a material and/or mediumwith sufficiently low electrical conductivity to prevent electricalshorts between first electrode 735 and second electrode 910.

When connecting to backplane 705, conductive link 750 can be formedbetween contact 710 and extension 915. As the connection point would beinsulated and/or spatially removed from first electrode 735, any damageto extension 915 during the connection process is less likely to cause apunch through short between first electrode 735 and second electrode910. In addition, as extension 915 is spatially removed from organiclight emitting layers 740, any thermal, mechanical, and/or chemicaldamage during the connecting process is less likely to damage theorganic light emitting layers 740, which can be susceptible to this typeof damage.

FIG. 10 shows active matrix display 1000, which can be an OLED display.Display 1000 is similar to display 700 in that display 1000 comprisesOLED assembly 715, having OLED substrate 720, first electrode 735,organic light emitting layers 740, and second electrode 745. When anelectrical potential is applied to pixel region 725 across firstelectrode 735 and second electrode 745, organic light emitting layers740 can emit human visible light that can pass through first electrode735 and OLED substrate 720 and be emitted in the direction of lightemission 755.

Display 1000 is different from display 700 in the structure of thebackplane, in that in display 1000, backplane substrate 1005 comprisesone or more vias 1015. Vias 1015 can comprise through passages thatconnect one face of backplane substrate 1005 to the opposing face.Alternatively and/or in addition, vias 1015 can comprise electricallyconductive paths that connect one face of backplane substrate 1005 tothe opposing face. Backplane 1002 can comprise transistors 55 a formedon and/or beneath the planar surface of planarized spheres 56 secured tobackplane substrate 1005. Contact 1010 can be in electricalcommunication with transistor 55 a, have an intermediate portion 1020that extends through via 1015, and terminate in terminal portion 1025 onor near the face of backplane substrate 1005 opposite the face on whichtransistor 55 a is formed. In embodiments where via 1015 comprises anelectrically conductive path, contact 1010 can comprise a conductivelink between transistor 55 a and a first end of the conductive path. Thesecond end of the conductive path near the opposite face of backplanesubstrate 1005 can then act as terminal portion 1025 of contact 1010. Inthese manners, an electrically conductive path can be provided betweenterminal portion 1025 and transistor 55 a. In some embodiments,insulating portion 1030 can electrically insulate some portions ofcontact 1010 from some portions of planarized sphere 56 and/ortransistor 55 a.

OLED assembly 715 can electrically connect to backplane 1002 viaconductive link 750 between second electrode 745 and terminal portion1025 of contact 1010. This geometry allows OLED assembly 715 to connectto the face of backplane 1002 opposite the face bearing transistors 55a. Since operation of transistors 55 a can generate heat, being able toconnect OLED assembly 715 to the face of backplane 1002 opposite theface bearing transistors 55 a can distance and at least partiallyprotect OLED assembly 715 from the heat generated by transistors 55 a.In particular, organic light emitting layers 740 can be susceptible todamage and/or degradation by heat, so distancing them fromheat-generating transistors 55 a can reduce the likelihood of thermaldamage and prolong the life of OLED assembly 715.

In all the embodiments described above in relation to FIGS. 7-10, thelight emitting assembly, such as OLED assembly 715, can be replaced witha detector assembly for detecting photons to yield an imager instead ofa display. The detector assembly can detect photons and in responseproduce an electrical signal. The signal, in turn, can be sampled by acontrollable gated electronic component such as transistor 55 a and/orother suitable circuit element on the backplane. It is contemplated thatthe controllable gated electronic components and other circuit elementsof an imager can be different than controllable gated electroniccomponents and circuit elements of a display. The detector assembly canbe an X-ray detector assembly for converting X-ray photons and inresponse generating an electrical signal. It is contemplated that thedetector assembly can comprise any detector configured to detect anexternal event and in response produce an electrical signal. Forexample, the detector can detect external events other than incidence ofphotons, such as contact with molecules, atoms, and/or subatomicparticles. It is envisioned that the detectors can be verticallyintegrated on top of the backplane.

FIGS. 11a-e show steps in a method 1100 for forming an electronic deviceon a semiconductor substrate. FIG. 11a shows a semiconductor substrate1105 having a surface 1107. A first quantity 1110 of a liquid medium isdeposited on a portion 1120 of surface 1107. A second quantity 1115 ofthe liquid medium is deposited on a portion 1125 of surface 1107. Firstquantity 1110 and second quantity 1115 are spaced from one another by agap 1130.

The liquid medium comprises a dopant configured for doping thesemiconductor substrate 1105. The liquid medium can comprise a mixtureof an organic component, glass precursors, and the dopant. The organicmaterial can comprise alpha-terpiniol, isopropyl alcohol, polyvinylalcohol, starches, carboxymethylcellulose, dextrin, wax emulsions,polyethylene glycols, lignosulfonates, methylcellulose, paraffins,polyacrylates, or any other suitable material. In general, a suitableorganic material can have one or more of the following characteristics:leave a minimal amount of ash after firing; easily burn out at lowtemperature; not be abrasive; allow for easy dispersion; not be toxic;and be inexpensive. The glass precursors can comprise silica or anyother suitable material. The dopant can comprise boron, phosphorus, orany other suitable material. The liquid medium can be a liquid and/or apaste in conditions (e.g. temperature and pressure) under which it isdeposited onto semiconductor substrate 1105.

In addition and/or instead, the liquid medium can comprise any othersuitable material or mixture of materials, including but not limited tohighly doped Si paste. In some embodiments, the liquid medium cancomprise a mixture of dopant, resin, and solvent, such as the mixturedescribed in Hitachi Chemical Technical Report No. 56, incorporatedherein by reference in its entirety. It is also contemplated that theliquid medium can comprise nanoparticles dispersed in a solvent, whichnanoparticles are doped with the dopant that can be used to dope thesemiconductor substrate; for example, see Yang, D. et al. “DopingSilicon Wafers with Boron by Use of Silicon Paste”, J. Mater. Sci.Technol., 2013, 29(7), 652-654, which is incorporated herein byreference in its entirety. Another example of the liquid medium caninclude the “Printable Dopants” made and sold by the Honeywellcorporation and described in a publication titled “Honeywell PrintableDopants for Advanced c-Si Cells”, which is also incorporated herein byreference in its entirety.

First quantity 1110 and second quantity 1115 can be in the form of anyone of a drop, a droplet, a globule, a platelet, a saucer, a blob, aglob, a dab, a smear, or any other quantity of the liquid mediumdeposited and resting on surface 1107. First quantity 1110 and secondquantity 1115 can be the same shape and or amount as one another, or canbe of different shape and/or amount from one another.

Since first quantity 1110 and second quantity 1115 are made of a liquidmedium, they can be printed on surface 1107 using any suitable printingtechnique. Some techniques for printing include, but are not limited to,screen printing, inkjet printing, stamping, flexography, gravure, andoffset printing. In general, any suitable printing technique can beused, depending on several factors including, but not limited to, theviscosity of the liquid medium comprising the dopant, the resolutionand/or minimum feature size, registration accuracy, and printingthroughput. The ability to use printing instead of lithography cansignificantly reduce the cost of the fabrication process.

Although the above description addresses a liquid medium comprising thedopant, it is also contemplated that the dopant can be in the form ofand/or be contained in solid particles that are electrostaticallydeposited on the semiconductor substrate. Such a deposition techniquecan be similar to the technique used in laser printing to transfer tonerparticles from the laser printer drum onto the paper, as describedabove. In other words, solid particles of the dopant and/or solidparticles containing the dopant can be laser printed on thesemiconductor substrate to form the first and second quantities. Such alaser printing technique may not require transferring any liquid orpaste onto the semiconductor substrate. A similar laser printingtechnique can also be used to print on the semiconductor substrate othercomponents formed in association with fabricating the electronic device(e.g. gate dielectric, source and drain contacts, gate contact, andbarrier island), which components are described in greater detail below.

In some embodiments, semiconductor substrate 1105 can be pre-doped andthe dopant in the liquid medium can allow changing the doping ofsemiconductor substrate 1105. For example, if semiconductor substrate1105 is p pre-doped, the dopant in the liquid medium can allowsemiconductor substrate 1105 to be n-doped, and vice versa. In theexemplary drawing of FIG. 11, semiconductor substrate 1105 can bepre-doped and used to form the conduction channel of a field-effecttransistor electronic device, the conduction channel extending betweenthe source and the drain of the transistor. The dopant from firstquantity 1110 and second quantity 1115 can be used to further dope(and/or change the doping of) semiconductor substrate 1105 to form thesource and the drain of the transistor.

Once first quantity 1110 and second quantity 1115 have been deposited onsurface 1107, substrate 1105, first quantity 1110 and second quantity1115 can be heated to cause diffusion of at least some of the dopantfrom the liquid medium of each of first quantity 1110 and secondquantity 1115 into surface 1107. The heating step can be performed in afurnace. FIG. 11b shows substrate 1105 after such a heating step, whichdepicts a first doped region 1135 doped from the dopant originating fromfirst quantity 1110 and a second doped region 1140 doped from the dopantoriginating from second quantity 1115.

The shape and size of the doped region depends on multiple factors,including but not limited to, nature of the dopant, composition ofsubstrate 1105, and the heating profile (e.g. temperature over time).The shape and relative sizes of doped regions 1135,1140 shown in FIG.11b (and in all the FIGS. that follow) are for illustrative purposesonly, and are not intended to be limiting. Moreover, the shape and sizeof first quantity 1110 and second quantity 1115 are shown as beingunchanged between FIG. 11a (before heating) and FIG. 11b (afterheating). This is for ease of illustration only, and it is contemplatedthat the shape, size, state, and/or composition of first quantity 1110and second quantity 1115 can change after the heating step.

In some embodiments, instead of the heating, a laser beam can bedirected onto surface 1107 to drive the dopant from first quantity 1110and second quantity 1115 into surface 1107. The use of a laser tofacilitate doping can avoid heating the entire semiconductor substrate1105 to high temperatures, and can allow for use of plastic and/orflexible substrates.

Once substrate 1105 has been doped by the dopant from the liquid medium,a dielectric material 1145 can be deposited on surface 1107 in gap 1130(gap 1130 is not marked in FIG. 11c , but is marked in FIG. 11a ). FIG.11c shows the dielectric material 1145 deposited in gap 1130. Dielectricmaterial 1145 can comprise aluminum oxide, a plastic such as polyimide,or any other suitable dielectric material. In some embodiments,dielectric material 1145 can comprise apolystyrene-block-poly(methylmethacrylate) composite material, such asthe material described in Ko, F. et al.“Polystyrene-block-poly(methylmethacrylate) composite material film as agate dielectric for plastic thin-film transistor applications” RSC Adv.,2014, 4, 18493, which is incorporated herein by reference in itsentirety. It is also contemplated that the dielectric material can begrown in the gap on the semiconductor substrate. For example, inembodiments where the semiconductor substrate comprises silicon, asilicon oxide (SiO₂) layer can be grown in the gap as the dielectricmaterial.

First quantity 1110 and second quantity 1115 can act as templates forthe deposition of dielectric material 1145 in gap 1130. In someembodiments, dielectric material 1145 can also be deposited bydepositing a quantity of a liquid and/or paste comprising the dielectricmaterial on surface 1107 in gap 1130. Such a liquid/paste quantitycomprising the dielectric material can be deposited by printing theliquid/paste on surface 1107 in gap 1130. In embodiments where thedielectric material is printed, the dielectric material containingliquid/paste can be in the liquid/paste state in conditions under whichit is transferred and/or printed onto surface 1107. Dielectric material1145 can be printed using the techniques described above in relation tofirst quantity 1110 and second quantity 1115

While dielectric material 1145 is shown as having a particular shape(e.g. flat top and curved sides), it is contemplated that dielectricmaterial 1145 can have any other suitable shape. For example, ifdielectric material 1145 has a large wetting angle with first quantity1110 and/or second quantity 1115 (i.e. if the dielectric material doesnot readily wet the first and second quantities), then dielectricmaterial 1145 can have a convex shape.

Once dielectric material 1145 has been deposited, first quantity 1110and second quantity 1115 can be selectively removed from surface 1107.FIG. 11d shows semiconductor substrate 1105 with first quantity 1110 andsecond quantity 1115 selectively removed. For example, selective wetchemical etching can be used to remove first quantity 1110 and secondquantity 1115 while leaving intact semiconductor substrate 1105 anddielectric material 1145. It is contemplated that any suitable selectiveremoval method can be used depending on the composition of firstquantity 1110, second quantity 1115, semiconductor substrate 1105, anddielectric material 1145. For example, if first quantity 1110 and secondquantity 1115 comprise silica/glass, semiconductor substrate 1105comprises silicon, and dielectric material 1145 comprises polyimide,then a wet chemical etching agent such as hydrofluoric acid or othersuitable acid can be used to selectively remove first quantity 1110 andsecond quantity 1115 from surface 1107.

Once first quantity 1110 and second quantity 1115 have been selectivelyremoved, electrical contacts 1150,1155 can be deposited on first portion1120 and second portion 1125 (marked in FIG. 11a ) of surface 1107. Inaddition, an electrical contact 1160 can be deposited on dielectricmaterial 1145. FIG. 11e shows semiconductor substrate 1105 after thedeposition of electrical contacts 1150,1155,1160. While FIG. 11e showselectrical contact 1150 as covering the entirety of first portion 1120and shows electrical contact 1155 as covering the entirety of secondportion 1125, it is contemplated that electrical contact 1150 canpartially cover first portion 1120 and/or electrical contact 1155 canpartially cover second portion 1125. Electrical contact 1160 isdeposited such that it does not come into electrical contact withelectrical contacts 1150 and 1155.

These electrical contacts 1150,1155,1160 can be printed using thetechniques described above in relation to first quantity 1110 and secondquantity 1115, or formed using any other suitable technique. One or moreof electrical contacts 1150,1155,1160 can comprise a metal, metalparticles, or any other suitable conductive material.

The structure shown in FIG. 11e can form a field effect transistor whereelectrical contact 1150 acts as the drain contact (marked “D” in FIG.11e ), electrical contact 1155 acts as the source contact (marked “S” inFIG. 11e ), electrical contact 1160 acts as the gate contact, anddielectric material 1145 acts as the gate barrier. The conductionchannel of the transistor can comprise the region inside semiconductorsubstrate 1105 (i.e. below surface 1107) between doped regions 1135 and1140.

A field effect transistor (FET) fabricated by method 1100 and the othermethods discussed below can have advantages overlithographically-fabricated FETs and thin-film transistors (TFT).Regarding lithographically-fabricated FETs, traditional lithography canbe very expensive, whereas method 1100 (and the other methods discussedbelow) can be carried out inexpensively using a material printer (e.g. adesktop inkjet printer) and a furnace. Regarding TFTs, their fabricationcan be limited by low thermal budgets (because excessive heat can damagetheir thin film components) and the TFTs themselves can have limitedperformance (e.g. relatively low electron mobility) due to thepotentially poor quality of the thin layers that form the FETs. Incontrast, fabricating FETs by method 1100 (and the other methodsdescribed below) can have a higher thermal budget because 1) there areno thin films that could be vulnerable to high temperatures, and 2)semiconductor substrate 1105 can comprise a high-quality crystallinesemiconductor that can have high electron mobility and can be lesssensitive to high temperatures than thin films of a TFT.

Generally, if the semiconductor substrate (that is used to form theconduction channel between the source and the drain) of an electronicdevice (e.g. a FET) is printed, such devices can have limitedperformance due to the low electron mobility of semiconductor materialsthat can typically be achieved by printing. In contrast, in method 1100(and the other methods described below) semiconductor substrate 1105(used to form the conduction channel) need not be printed, but rathercan be a high quality, crystalline semiconductor material withrelatively high electron mobility. In this way, method 1100 combines thelow cost advantages of printing electronics, with the high performance(e.g. high electron mobility) and higher thermal budget made possible byusing a high quality, crystalline semiconductor substrate onto whichother components can be printed.

Semiconductor substrate 1105 can comprise any semiconductor materialsuitable for forming electronic devices. In some embodiments,semiconductor substrate 1105 can comprise a planarized semiconductorparticle fixed upon another substrate, such as the planarized sphere 56shown in FIG. 5b . Other examples of semiconductor substrate 1105 caninclude, but are not limited to, planarized spheres 16 shown in FIGS. 3and 4.

In some embodiments, semiconductor substrate 1105 can compriseplanarized islands of a semiconductor material formed in situ on another(e.g. non-semiconductor) substrate by heating particulate/powdersemiconductor precursors deposited on the other substrate. The heatingcan melt and fuse the particles to form a molten globule. Cooling theglobule can solidify and crystallize the molten globule to form acrystalline island of the semiconductor material secured to the othersubstrate. This method of forming semiconductor islands is described inU.S. Pat. No. 9,396,932 and also in U.S. patent application Ser. No.15/184,429, both of which are incorporated herein by reference in theirentirety. When planarized, such semiconductor islands can act assemiconductor substrate 1105.

In certain circumstances, the in situ formation of semiconductor islandscan yield disk-shaped semiconductor islands as described in U.S. patentapplication Ser. No. 15/184,429. A non-limiting example of suchcircumstances includes heating a silicon precursor (powder or pieces) onan alumina substrate to a temperature above the melting point of silicon(e.g. 1500° C.) in the presence of oxygen (either in the atmospheres orin another material in contact with the molten globule). Under theseconditions, a disk/layer comprising silica can form between thecrystalline silicon island and the alumina substrate, and thecrystalline silicon island can be disk-shaped. Such a disk-shapedsilicon island can also be used (optionally after polishing and/orplanarization) as semiconductor substrate 1105.

Surface 1107 can comprise a planar surface. In embodiments wheresemiconductor substrate 1105 comprises a planarized semiconductorparticle, surface 1107 can comprise the planar surface formed at theplanarized cross-section of the planarized semiconductor particle.Moreover, while FIGS. 11a-e show surface 1107 as being planar, it iscontemplated that surface 1107 can also be curved. For example, surface1107 can comprise the curved or otherwise non-planar outer surface of asemiconductor particle or the curved surface of a flexible semiconductorsubstrate. Semiconductor substrate 1105 can comprise a poly- orsingle-crystalline semiconductor material, including but not limited to,silicon. Semiconductor substrate 1105 can be pre-doped before steps ofmethod 1100 are carried out.

In some embodiments, semiconductor substrate 1105 can comprise asemiconductor wafer, or other suitable poly- or single-crystallinesemiconductor substrate other than a semiconductor particle that isformed separately from another substrate and then fixed upon that othersubstrate.

In some embodiments, the gate contact (formed by electrical contact1160) can be deposited after the depositing of dielectric material 1145and before the selective removal of first quantity 1110 and secondquantity 1115. In these embodiments, electrical contact 1160 is selectedto be impervious to and/or unaffected by the selective removal methodused to selectively remove first quantity 1110 and second quantity 1115.

In some embodiments, a barrier island can be deposited on the surface inthe gap before the first and second quantities are deposited. Thisbarrier island can help to control the length of the gap, which isdetermined by (among other factors) the distance between the first andsecond quantities. As the length of the gap determines (along with otherfactors) the length of the conduction channel of the FET inside thesemiconductor substrate, controlling the length of the gap can help tocontrol the length of the conduction channel and the performancecharacteristics of the FET.

In some embodiments, the length of the gap, i.e. the distance betweenthe first and second quantities, can be in the range of about 0.1 μm toabout 100 μm. In other embodiments, the length of the gap, i.e. thedistance between the first and second quantities, can be in the range ofabout 0.1 μm to about 10 μm. In yet other embodiments, the length of thegap, i.e. the distance between the first and second quantities, can bein the range of about 0.1 μm to about 5 μm.

FIGS. 12a-f show steps in a method 1200 for forming an electronic device(e.g. a FET) using such a barrier island. FIG. 12a shows barrier island1205 deposited on surface 1107 in gap 1130. Barrier island 1205 can beformed of any suitable material that can form a barrier to firstquantity 1110 and second quantity 1115, and can be selectively removedfrom substrate 1105, as will be discussed in greater detail below. Insome embodiments, barrier island 1205 can be deposited as a liquidand/or paste quantity. The liquid/paste comprising a barrier material(used to form the barrier island) can comprise an organic material suchas a plastic such as polyimide, or any other suitable material. Theliquid/paste comprising the barrier material can be printed onsemiconductor substrate 1105 using the same methods described above inrelation to printing first quantity 1110 and second quantity 1115.

While one or more of the first quantity, the second quantity, thedielectric material, the barrier island, and the electrical contacts canbe deposited using a printing technique, it is contemplated that two ormore different printing techniques can be used to print thesecomponents.

After depositing barrier island 1205 in gap 1130, first quantity 1110and second quantity 1115 can be deposited on first portion 1120 andsecond portion 1125 of surface 1107 respectively, as shown in FIG. 12b .As discussed above, barrier island 1205 can act as a barrier preventingfirst quantity 1110 and second quantity 1115 from encroaching (e.g. byflowing and/or spreading) onto gap 1130.

Next, semiconductor substrate 1105, first and second quantities 1110 and1115, and barrier island 1205 can be heated to cause diffusion of atleast some of the dopant from first and second quantities 1110 and 1115into surface 1107 to form doped regions 1135 and 1140 respectively, asshown in FIG. 12c . The heating can also selectively remove (e.g. burnoff) barrier island 1205 to clear surface 1107 in gap 1130 for laterdeposition of a dielectric material 1245, as shown in FIG. 12d . In someembodiments, barrier island 1205 can be selectively removed using wetchemical etching or other selective removal method other than heating.

Dielectric material 1245 can have a composition and be deposited in amanner similar to dielectric material 1145. Dielectric material 1245 canhave a small wetting angle with first quantity 1110 and second quantity1115. Dielectric material 1245 can wet first quantity 1110 and secondquantity 1115 at a wetting angle smaller than about 90°. In other words,dielectric material 1245 can readily wet first quantity 1110 and secondquantity 1115. This can in turn determine the shape of dielectricmaterial 1245, i.e. having a concave top and curved sides, as shown inFIGS. 12d -f.

After the deposition of dielectric material 1245, steps of method 1200depicted in FIGS. 12d, 12e, and 12f are generally similar to the stepsof method 1100 shown in FIGS. 11c, 11d, and 11e , with one differencebeing that electrical contact 1260 is shaped differently than electricalcontact 1160. The shape of electrical contact 1260 is determined by thecurvature of the top surface of dielectric material 1245. In theembodiments where electrical contact 1260 is deposited and/or printed asa liquid, the concave top of dielectric material 1245 can pool and/ordirect the electrical contact away from electrical contacts 1150 and1155. This can help in preventing any electrical shorts betweenelectrical contact 1260 and electrical contacts 1150 and 1155respectively.

While dielectric material 1145 is shown in FIG. 11 as having a differentshape than dielectric material 1245 in FIG. 12, it is contemplated thatthe dielectric material in one or both of methods 1100 and 1200 can beshaped similar to either one of dielectric material 1145 or dielectricmaterial 1245.

In some embodiments, barrier island 1205 can comprise the same materialas dielectric material 1245, in which case barrier island 1205 is notselectively removed, but rather remains on surface 1107 throughout thesteps of method 1200. In these embodiments, however, barrier island 1205may not have the same shape as dielectric material 1245 because thebarrier island 1205 would have been deposited before the deposition offirst quantity 1110 and second quantity 1115.

In some embodiments, the liquid medium of the first and secondquantities can undergo a reduction in volume after being deposited onthe surface of the semiconductor substrate. This reduction in volume canbe due to various factors including, but not limited to, evaporation ofsome or all of any volatile components of the liquid medium during a“bake out” step. FIGS. 13a-g show steps of a method 1300 for forming anelectronic device, which method uses this reduction in volume.

First, as shown in FIG. 13a , barrier island 1205 is deposited onsurface 1107. This step can be similar to the first step in method 1200shown in FIG. 12a . Next, as shown in FIG. 13b , an initial quantity1305 of the liquid medium (comprising the dopant) can be deposited onsurface 1107 to cover first portion 1120 and second portion 1125 ofsurface 1107 as well as covering barrier island 1205, which in turncovers gap 1130. As discussed above, barrier island 1205 can be disposedin gap 1130 between first portion 1120 and second portion 1125. Volumeof initial quantity 1305 is larger than the combined volumes of firstquantity 1110 and second quantity 1115.

During the bake out step, the volume of initial quantity 1305 will bereduced as discussed above. The bake out, and the accompanying reductionin volume, can be due to preliminary heating, or any other step that cancause a reduction in the volume of initial quantity 1305 due to an atleast partial loss of volatile components of the liquid medium. FIG. 13cshows that after the volume of initial quantity 1305 is reduced duringthe bake out, previously-covered barrier island 1205 can be exposed, andinitial quantity 1305 can form smaller first quantity 1110 and secondquantity 1115. While FIG. 13c shows first quantity 1110 to be the sameshape and size as second quantity 1115, it is contemplated that thefirst and second quantities formed as a result of the bake out can havedifferent shapes and sizes from one another. In addition, while in FIGS.13c-e first quantity 1110 and second quantity 1115 are depicted as beingof similar shape and size as the corresponding first and secondquantities in FIGS. 11a-c and 12b-d , it is contemplated that the firstand second quantities obtained by a reduction in the volume of initialquantity 1305 (in method 1300) can have a shape and/or size that isdifferent than the first and second quantities that are deposited onsemiconductor substrate 1105 in methods 1100 (FIGS. 11) and 1200 (FIG.12).

The last five steps of method 1300 shown in FIGS. 13c-13g can be similarto the last five steps of method 1200, as shown in FIGS. 12 b-f, andwill not be described here in detail again.

In some embodiments, the barrier island can be formed by depositing alayer of photo-reactive material on the surface of the semiconductorsubstrate, exposing an area of the photo-reactive material overlayingthe gap to light to modify the photo-reactive material, and selectivelyremoving unexposed regions of the photo-reactive material from thesurface thereby forming the barrier island comprising the photo-reactivematerial modified by the light. The photo-reactive material can comprisea photo-resist including, but not limited to, a negative photo-resistsuch as the Shipley BPR™-100 Photoresist. Exposing the photo-reactivematerial to light can be performed without the need for expensive and/orcomplicated photolithography equipment. For example, the light exposurecan be performed using a light source, such as a UV LED or laser,attached to the print head of an inkjet printer.

FIGS. 14a-g show steps in a method 1400 where a barrier island is formedby exposing a layer of a photo-reactive material and then selectivelyremoving the unexposed portions. FIG. 14a shows a layer of aphoto-reactive material 1405 deposited on substrate 1105. Photo-reactivematerial 1405 can be spin-coated, or deposited on the semiconductorsubstrate using any other suitable technique. Photo-reactive material1405 can comprise a photo-resist, or any other suitable material,including, but not limited to, a negative photo-resist such as theShipley BPR™-100 Photoresist.

Then, a region of the photo-reactive material overlaying gap 1130(marked in FIG. 14b ) can be exposed to a light that is configured tomodify the photo-reactive material. After this exposure andmodification, the unexposed portions of the layer of photo-reactivematerial 1405 can be selectively removed to form a barrier island 1410comprising the photo-reactive material modified by the light, as shownin FIG. 14b . By utilizing an optical source such as a UV laser, havinga micron, or sub-micron spot size, it can be possible to direct-writesmall features such as barrier island 1410. The selective removal stepcan remove the unexposed portions of the layer of photo-reactivematerial 1405, while leaving the exposed portion of the photo-reactivematerial and the semiconductor substrate intact. The selective removalcan comprise wet chemical etching or any other suitable selectiveremoval method.

Once barrier island 1410 has been formed, first quantity 1110 can bedeposited on first portion 1120 and second quantity 1115 can bedeposited on second portion 1125 of surface 1107, as shown in FIG. 14c .The last five steps of method 1400, shown in FIGS. 14c-g can be similarto the last five steps of method 1200, shown in FIGS. 12b-f , and willnot be described in detail again here.

Methods 1100, 1200, 1300, and 1400 can be used to form and/or fabricatecontrollable gated electronic components, including but not limitedtransistors such as FETs. As discussed above, these methods can becarried out on semiconductor substrates which are the planarizedsemiconductor particles, which particles are formed separately fromanother substrate and then immovably fixed to that other substrate. Forexample, transistors 55 a, 55 b, shown in FIGS. 5c , 7, 8, and 10 can beformed using one or more of methods 1100, 1200, 1300, and 1400.

Turning now to FIG. 15, a schematic cross-section of an example lightsource 1505 is shown. Light source 1505 can comprise a backplane 1510electrically connected to a light emitter. The light emitter cancomprise three individual LEDs 1525R, 1525G, and 1525B (collectivelyreferred to as LEDs 1525) which can emit colors red, green, and bluerespectively. In some implementations, the light emitter can compriseone, two, or any number of LEDs of any colors. Moreover, in someimplementations, the light emitter can comprise an LED assembly, an LEDpixel or pixel region, an LED package, and/or a chipLED as describedherein, for example in relation to FIGS. 7a-c . Furthermore, in someimplementations the light emitter can comprise an one or more OLEDs,OLED assemblies, OLED pixels and/or pixel regions, quantum dots, and/orother light emitters instead of and/or in addition to LEDs.

Backplane 1510 can comprise a semiconductor particle 1515 secured to abackplane substrate 1520. Semiconductor particle 1515 can be formedseparately from backplane substrate 1520 and then fixed upon backplanesubstrate 1520 at a predetermined position. Semiconductor particle 1515can then be planarized to remove a portion of semiconductor particle1515 and to expose at a cross section of semiconductor particle 1515 aplanar surface. A controllable gated electronic component (not shown)can be formed on or directly beneath the planar surface. Planarizedsemiconductor particles 1515 can be similar to planarized spheres 56,and backplane substrate 1520 can be similar to substrate 10. In someimplementations, planarized semiconductor particles 1515 can comprisesingle-crystal silicon. Moreover, in some implementations backplanesubstrate 1520 can comprise Low Temperature Co-Fired Ceramic (LTCC) suchas, but not limited to, DuPont™ 951.

While FIG. 15 shows the planarized surface of semiconductor particle1515 as being raised above or offset from the surface of backplanesubstrate 1520, it is contemplated that in some implementations thisoffset need not exist. Moreover, light source 1505 can also comprise adielectric and/or wiring layer 1530 disposed between LEDs 1525 andbackplane 1510. LEDs 1525 can connect to backplane 1510 via dielectricand/or wiring layer 1530. Dielectric and/or wiring layer 1530 canfacilitate connecting multiple LEDs 1525 to one or more correspondingelectrical components (such as transistors) on or directly beneath theplanar surface of semiconductor particle 1515. In some implementations,dielectric and/or wiring layer 1530 can be similar in structure and/orfunction to dielectric and/or wiring layer 772.

The connection between LEDs 1525 and backplane 1510 can electricallyconnect at least one of the LEDs 1525 to the controllable gatedelectronic component on or in semiconductor particle 1515. Theelectrical connection can be configured to allow the controllable gatedelectronic component to control the at least one of the LEDs 1525.

In some implementations, groups of different color LEDs 1525 can bearranged into one or more pixels, which pixels can display a variety ofdifferent colors by activating combinations of different color LEDs1525. Moreover, in some implementations, after LEDs 1525 are positionedon and connected to backplane 1510, the LEDs 1525 can be partially orfully covered by optical encapsulation (not shown). This encapsulationcan protect LEDs 1525 from the elements such as humidity and dust, whileallowing most of the light emitted by LEDs 1525 to be transmitted.Optical encapsulation can comprise, for example and without limitation,DuPont™ 8190 or similar glass paste. In some implementations, this glasspaste can be suitably thinned as needed and spun-on (or otherwiseapplied) as a conformal coating.

Generally, it is contemplated that in some implementations the lightemitters described herein can be encapsulated by optical encapsulationas described herein and as shown, for example, in FIG. 7b . Moreover, itis contemplated that the light emitters described herein can have wirebonds or other electrical connectors similar to connectors 770 describedin relation to FIG. 7b . FIGS. 15-19 omit such connectors forsimplicity.

Light source 1505 can also comprise a circuit board 1535 disposed on theside of backplane 1510 that is opposite the LEDs 1525 of the lightemitter, and backplane 1510 can be electrically connected to circuitboard 1535. Circuit board 1535 can comprise a substrate that comprises,on or within it, one or more of wiring, electrical connections, circuitcomponents, or electronic components. In some implementations, circuitboard 1535 can comprise a Printed Circuit Board (PCB). Moreover, in someimplementations circuit board 1535 can comprise a ceramic such as LTCC.

Furthermore, backplane 1510 can comprise a first conductive via 1540passing through backplane 1510 and dielectric and/or wiring layer 1530.First conductive via 1540 can connect circuit board 1535 to at least oneof the LEDs 1525 making up the light emitter. Backplane 1510 can alsocomprise a second conductive via 1545 passing through backplane 1510.Second conductive via 1545 can connect circuit board 1535 to dielectricand/or wiring layer 1530. Conductive vias 1540 and 1545 can comprisepassages in backplane substrate 1520, which are at least partiallyfilled with a conductive material to form an electrically conductivevia. For example, and without limitation, the conductive material cancomprise a metal.

Conductive vias 1540 and 1545 can bring power and/or control signalsfrom circuit board 1535 to LEDs 1525 and to dielectric and/or wiringlayer 1530. Dielectric and/or wiring layer 1530, in turn, can transmitthe signals to the electronic components on or in the planar surface ofsemiconductor particle 1515, and/or to LEDs 1525.

Light sources 1550 and 1555 can be the same as light source 1505. Asshown in FIG. 15, in some implementations multiple light sources 1505,1550, and 1555 can be connected to a common circuit board 1535 to form alight source assembly 1500. This can allow multiple light sources towork together to form a display, a video wall, a tiled display, or thelike. Light sources 1505, 1550, and 1555 can be picked and placed oncircuit board 1535, or assembled on circuit board 1535 using any of theother methods described herein, for example in relation to FIGS. 7a-c .In this manner, if one light source is faulty, it can be removed orreplaced without the need to discard the remaining light sourcesconnected to the circuit board.

Turning now to FIG. 16, a schematic cross-section of an example lightsource 1605 is shown. Light source 1605 can be similar to light source1505, with a difference being that instead of individual LEDs lightsource 1605 can comprise an LED package 1610. LED package 1610 can besimilar to LED package 782 described herein, for example in relation toFIG. 7 c.

LED package 1610 can comprise one or more individual LEDs (not shown).In some implementations, LED package 1610 can comprise LEDs capable ofemitting primary colors. In yet other implementations, LED package 1610can comprise a sufficient variety of different color LEDs to be able tooperate as an individual color pixel.

LED package 1610 can also comprise electrical contacts 1615 and 1620,for connecting LED package 1610 to backplane 1510, to circuit board1535, and/or to dielectric and/or wiring layer 1530. In someimplementations, electrical contacts 1615 and 1620 can allow each LEDwithin LED package 1610 to be controlled separately and/or controlledusing separate corresponding control signals and/or power signals. Inother implementations, all the LEDs in the LED package 1610 can becontrolled with the same control signal and/or power signal.

Moreover, in some implementations, LED packages can comprise otherelectrical or electronic components for operating the individual LEDscontained within each LED package. In some implementations, the LEDpackages can comprise but are not limited to chipLEDs or Surface MountDevices (SMD) containing LEDs. In some implementations, LRTB R48GchipLED made by OSRAM™ Opto Semiconductors can be used as a non-limitingexample of an LED package. LED package 1610 can be positioned and/orplaced on backplane 1510 by any one or more of the different methodsdescribed herein in relation to positioning individual LEDs onbackplanes 762 or 1510.

Light sources 1625 and 1630 can be the same as light source 1605. Asshown in FIG. 16, in some implementations multiple light sources 1605,1625, and 1630 can be connected to a common circuit board 1535 to form alight source assembly 1600. Light source assembly 1600 can have similaror the same components, functions, and/or uses as light source assembly1500.

FIG. 17 shows an example light source 1705 comprising LEDs 1525connected to a backplane 1710. LEDs 1525 are an example of a lightemitter, which can be any suitable LED emitter, or other suitable lightemitter as described herein, for example in relation to FIGS. 7a-c and15-16.

Backplane 1710, in turn, can comprise semiconductor particle 1515secured to a backplane substrate 1720. Backplane substrate 1720 can besimilar to backplane substrate 1520, with a difference being thatbackplane substrate 1720 may not have passages or conductive viastraversing its thickness. In some implementations, backplane 1710 cancomprise a wiring layer 1725 to provide electrical connectivity to theelectronic components on or in the planarized surface of semiconductorparticle 1515. Wiring layer 1725 can be formed using any suitabletechnique, including but not limited to lithography, printing, and thelike.

Light source 1705 can further comprise a circuit board 1730 disposedbetween LEDs 1525 and backplane 1710. LEDs 1525 can be electricallyconnected to backplane 1710 via circuit board 1730. Circuit board 1730can be similar in structure and/or function to circuit board 1535. Insome implementations, circuit board 1730 can comprise an LTCC. Moreover,in some implementations, circuit board 1730 can comprise a PCB includingbut not limited to a suitable FR4 PCB.

A connector 1745 can bring power and/or control signals to circuit board1730 for powering and/or controlling LEDs 1525. Moreover, light source1705 can comprise connectors 1735 and 1740 for connecting the circuitboard to wiring layer 1725 of backplane 1710. While FIG. 17 showsconnectors 1735 and 1740 connected to wiring layer 1725, it iscontemplated that in some implementations connectors 1735 and 1740 canbe connected directly to the electronic components on or in theplanarized surface of semiconductor particle 1515. In suchimplementations, backplane 1710 may not comprise wiring layer 1725.

Light sources 1750 and 1755 can be similar to or the same as lightsource 1705. As shown in FIG. 17, in some implementations multiple lightsources 1705, 1750 and 1755 can share a common circuit board 1730 toform a light source assembly 1700. Light source assembly 1700 can havesimilar functions and/or uses as light source assembly 1500. One or moreof the light emitter (e.g. LEDs 1525) and backplane 1710 can be pickedand placed on circuit board 1730. Light source 1705 and/or light sourceassembly 1700 can be assembled using any of the techniques describedherein, for example in relation to FIGS. 7a -c.

FIG. 18 shows a schematic cross-section of an example light source 1805.Light source 1805 can be similar to light source 1705, with thedifference being that instead of individual LEDs light source 1805 cancomprise LED package 1610. LED package 1610 can be connected to circuitboard 1830, which can be similar to circuit board 1730. In someimplementations, circuit board 1730 can comprise LTCC to handle the heatgenerated during the operation of LEDs 1525. Circuit board 1830, inturn, can comprise PCB in cases where LED package 1610 comprises thermalmanagement features to reduce the thermal load placed by LED package1610 on its respective circuit board 1830 compared to the thermal loadplaced by LEDs 1525 on their circuit board 1730.

Light sources 1835 and 1840 can be similar to or the same as lightsource 1805. As shown in FIG. 18, in some implementations multiple lightsources 1805, 1835 and 1840 can be connected to a common circuit board1830 to form a light source assembly 1800. Light source assembly 1800can have similar functions and/or uses as light source assembly 1500.One or more of the light emitter (e.g. LED packages 1610) and backplane1710 can be picked and placed on circuit board 1830. Light source 1805and/or light source assembly 1800 can be assembled using any of thetechniques described herein, for example in relation to FIGS. 7a -c.

FIG. 19 shows a schematic cross-section of an example light sourceassembly 1900 comprising light source 1805 and light sources 1905 and1910 sharing the same circuit board 1830. A difference between lightsource assembly 1800 and light source assembly 1900 is that unlike lightsource assembly 1800, in light source assembly 1900 light sources 1905and 1910 share a common backplane 1915. Backplane 1915 can be similar tobackplane 1710, with a difference being that backplane 1915 comprisesmultiple semiconductor particles 1515 secured to a common backplanesubstrate 1920.

Having a backplane that is common among multiple light sources canreduce the amount of time required to assemble light source assembly1900, as it reduces the number of components that need to be positionedon circuit board 1830 to assemble light source assembly 1900. In otherwords, instead of having to position two backplanes on the circuit boardfor light sources 1905 and 1910, only one backplane 1915 needs to bepositioned on circuit board 1830. A trade-off can be that if there is amalfunction in backplane 1915, potentially two light sources 1905 and1910 would be effected, as compared to one affected light sourceassembly in the case each of light sources 1905 and 1910 has its ownseparate backplane. It is contemplated that in some implementations themulti-semiconductor particle backplane configurations similar to thatshown in FIG. 19 can also be applied to light source assemblies 1500,1600, 1700, and 1800.

In general, the light sources described herein comprise the backplanesdescribed herein electrically connected to a light emitter such as anLED emitter comprising one or more LEDs electrically connected to thebackplane such that at least one of the LEDs is electrically connectedto corresponding one or more of the controllable gated electroniccomponents of the backplane. The LED emitter can comprise any suitablecollection, arrangement, or configuration of one or more LEDs. Forexample, and without limitation, the LED emitter can comprise individualLEDs and/or individual LED packages electrically connected to thebackplane, as shown in FIGS. 15-19. In other implementations, the LEDemitter can comprise an LED assembly in turn comprising LEDs and/or LEDpixel regions formed on a substrate. In yet other implementations, theLED assembly can comprise LEDs or LED packages formed separately fromthe substrate and then secured to the substrate, the substrate beingseparate from the backplane.

While FIGS. 15-19 show example light source assemblies comprising threelight sources, it is contemplated that the light source assemblies cancomprise one, two, four, or a different number of light sources that canbe accommodated by the circuit board. Moreover, while FIGS. 15-19 showthe light sources as part of light source assemblies, it is contemplatedthat the light sources can be individual or individuated, and/or can befabricated in assemblies comprising one, two, four, or a differentnumber of light sources. Furthermore, while FIGS. 15-18 show thebackplanes as comprising one semiconductor particle and FIG. 19 showsbackplanes as comprising one or two semiconductor particles, it iscontemplated that the light sources disclosed herein can comprisebackplanes having one, two, three, or a different number ofsemiconductor particles.

In some implementations, the light sources disclosed herein can be usedas active pixels or active-pixel chiplets. Moreover, the light sourcesand/or the light source assemblies disclosed herein can be used in videowalls and/or other types of displays. Such displays can be usedindividually, or can be tiled together to cover larger areas.

The above-described embodiments of the invention are intended to beexamples of the present invention and alterations and modifications maybe effected thereto, by those of skill in the art, without departingfrom the scope of the invention which is defined solely by the claimsappended hereto.

What is claimed is:
 1. A method of forming a light source, the methodcomprising: providing a backplane comprising: providing a backplanesubstrate; providing a semiconductor particle formed separately from thebackplane substrate; positioning the semiconductor particle at apredetermined position on the backplane substrate; immovably fixing thesemiconductor particle to the backplane substrate at the predeterminedposition; after immovably fixing the semiconductor particle, removing aportion of the semiconductor particle so as to expose a cross-section ofthe semiconductor particle, wherein the cross-section is a planarsurface; and providing one or more controllable gated electroniccomponents on or directly beneath the planar surface, the controllablegated electronic components configured to control a light emitter; andproviding the light emitter connected to the backplane such that thelight emitter is electrically connected to corresponding one or more ofthe controllable gated electronic components.
 2. The method of claim 1,wherein the light emitter comprises one or more of: one or moreindividual LEDs, at least one individual LED electrically connected tocorresponding one or more of the controllable gated electroniccomponents; one or more individual LED packages, each LED packagecomprising one or more corresponding LEDs, at least one LED packageelectrically connected to the backplane such that the corresponding LEDsare electrically connected to corresponding one or more of thecontrollable gated electronic components; and an LED assembly comprisingone or more pixel regions, the LED assembly electrically connected tothe backplane such that at least one of the pixel regions iselectrically connected to corresponding one or more of the controllablegated electronic components.
 3. The method of claim 1, furthercomprising electrically connecting the backplane to a circuit boarddisposed on a side of the backplane opposite the light emitter.
 4. Themethod of claim 1, wherein a circuit board is disposed between thebackplane and the light emitter, and the light emitter is electricallyconnected to the backplane via the circuit board.
 5. A method of forminga light source, the method comprising: providing a backplane comprising:a backplane substrate; a semiconductor particle formed separately fromthe backplane substrate and then fixed upon the backplane substrate at apredetermined position; the semiconductor particle planarized to removea portion of the semiconductor particle and to expose at a cross-sectionof the semiconductor particle a planar surface; and a controllable gatedelectronic component on or directly beneath the planar surface, thecontrollable gated electronic component configured to control a lightemitter; and providing the light emitter electrically connected to thebackplane such that the light emitter is electrically connected to thecontrollable gated electronic component.
 6. The method of claim 5,wherein the light emitter comprises one or more of: one or moreindividual LEDs, at least one individual LED electrically connected tothe controllable gated electronic component; one or more individual LEDpackages, each LED package comprising one or more corresponding LEDs, atleast one LED package electrically connected to the backplane such thatone or more of the corresponding LEDs are electrically connected to thecontrollable gated electronic component; and an LED assembly comprisingone or more pixel regions, the LED assembly electrically connected tothe backplane such that at least one of the pixel regions iselectrically connected to the controllable gated electronic component.7. The method of claim 5, further comprising electrically connecting thebackplane to a circuit board disposed on a side of the backplaneopposite the light emitter.
 8. The method of claim 7, wherein thecircuit board comprises a Printed Circuit Board (PCB).
 9. The method ofclaim 7, wherein a wiring layer is disposed between the backplane andthe light emitter, and the light emitter is electrically connected tothe backplane via the wiring layer.
 10. The method of claim 9, whereinthe backplane comprises: a first conductive via passing through thebackplane and the wiring layer, the first conductive via connecting thecircuit board to the light emitter; and a second conductive via passingthrough the backplane, the second conductive via connecting the circuitboard to the wiring layer.
 11. The method of claim 5, wherein a circuitboard is disposed between the backplane and the light emitter, and thelight emitter is electrically connected to the backplane via the circuitboard.
 12. A light source comprising: a backplane comprising: abackplane substrate; a semiconductor particle formed separately from thebackplane substrate and then fixed upon the backplane substrate at apredetermined position; the semiconductor particle planarized to removea portion of the semiconductor particle and to expose at a cross-sectionof the semiconductor particle a planar surface; and a controllable gatedelectronic component on or directly beneath the planar surface; andlight emitter electrically connected to the backplane such that thelight emitter is electrically connected to the controllable gatedelectronic component, the electrical connection configured to allow thecontrollable gated electronic component to control the light emitter.13. The light source of claim 12, wherein the light emitter comprisesone or more individual LEDs, at least one individual LED electricallyconnected to the controllable gated electronic component.
 14. The lightsource of claim 12, wherein the light emitter comprises one or moreindividual LED packages, each LED package comprising one or morecorresponding LEDs, at least one LED package electrically connected tothe backplane such that one or more of the corresponding LEDs areelectrically connected to the controllable gated electronic component.15. The light source of claim 12, wherein the light emitter comprises anLED assembly comprising one or more pixel regions, the LED assemblyelectrically connected to the backplane such that at least one of thepixel regions is electrically connected to the controllable gatedelectronic component.
 16. The light source of claim 12, furthercomprising a circuit board disposed on a side of the backplane oppositethe light emitter, the backplane electrically connected to the circuitboard.
 17. The light source of claim 16, wherein the circuit boardcomprises a Printed Circuit Board (PCB).
 18. The light source of claim16, wherein a wiring layer is disposed between the backplane and thelight emitter, and the light emitter is electrically connected to thebackplane via the wiring layer.
 19. The light source of claim 18,wherein the backplane comprises: a first conductive via passing throughthe backplane and the wiring layer, the first conductive via connectingthe circuit board to the light emitter; and a second conductive viapassing through the backplane, the second conductive via connecting thecircuit board to the wiring layer.
 20. The light source of claim 12,wherein a circuit board is disposed between the backplane and the lightemitter, and the light emitter is electrically connected to thebackplane via the circuit board.